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Environmentally Safe Plating of Tin-Lead Alloy Coatings

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Abstract

The aim of this experimental study was to minimize the input of lead and tin ions and fluoboric acid into the waste water from the electroplating line, where the printed circuit boards and other parts of electronic devices are plated with tin-lead alloy. For this purpose, after unloading the parts from the plating tank, they were rinsed in the reclaim tank, from which the aforementioned ions were removed with a reclaim immersed electrochemical module (IEM).

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REFERENCES

  1. Il'in, V.A., Khimicheskie i elektrokhimicheskie protsessy v proizvodstve pechatnykh plat (Chemical and Electrochemical processes in the Production of Printed Circuit Boards), Moscow: 1994, p. 141.

  2. Vinogradov, S.S., Ekologicheski bezopasnoe gal'vanicheskoe proizvodstvo (Environmentally Safe Plating Process), Kudryavtsev, V.N., Ed., Moscow: Globus, 1998.

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Authors and Affiliations

  1. Mendeleev University of Chemical Technology, Miusskaya pl. 9, Moscow, 125047, Russia

    S. S. Kruglikov, D. Yu. Turaev & A. A. Borodulin

Authors
  1. S. S. Kruglikov
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  2. D. Yu. Turaev
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  3. A. A. Borodulin
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Translated from Zashchita Metallov, Vol. 41, No. 6, 2005, pp. 637–639.

Original Russian Text Copyright © 2005 by Kruglikov, Turaev, Borodulin.

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Kruglikov, S.S., Turaev, D.Y. & Borodulin, A.A. Environmentally Safe Plating of Tin-Lead Alloy Coatings. Prot Met 41, 589–591 (2005). https://doi.org/10.1007/s11124-005-0085-1

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  • DOI: https://doi.org/10.1007/s11124-005-0085-1

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