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Investigation of the Electroless Nickel Plated Sic Particles in Sac305 Solder Matrix

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Powder Metallurgy and Metal Ceramics Aims and scope

In the present study, an electroless nickel (EN) plating method is applied for the coating of silicon carbide (SiC) particles. The particles of SiC(Ni) were added to the Sn–3.0Ag–0.5Cu matrix for the production of SAC305/SiC(Ni) composite by the powder metallurgy route. SAC305/xSi(Ni) composite was prepared by a planetary ball milling of the starting powder, followed by compacting and sintering. Nickel-coated silicon carbide particles and the lead-free solder matrix react together, forming different phases during sintering at temperature 200°C for 3 h. The microstructure, mechanical (compressive strength, microhardness, wettability, and porosity) and physical properties (density) of lead-free solder composite SAC305/SiC(Ni) were studied. The current research shows the successful application of electroless nickel (EN) plating method, and how nickel-coated SiC particles subsequently improve the mechanical properties and microstructure of lead-free solder.

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  1. Z.P. Yang and W. Zhou, “Effects of Ni-coated carbon nanotubes addition on the electromigration of Sn–Ag–Cu solder joints,” J. Alloys Compd., 581,202–205 (2013).

    Article  CAS  Google Scholar 

  2. Z. Yang, W. Zhou, and P. Wu, “Effects of Ni-coated carbon nanotubes addition on the micro-structure and mechanical properties of Sn–Ag–Cu solder alloys,” Mater. Sci. Eng. A., 590, 295–300 (2014).

    Article  CAS  Google Scholar 

  3. X.D. Liu, Y.D. Han, H.Y. Jing, J. Wei, and L.Y. Xu, “Effect of graphene nanosheets reinforcement on the performance of Sn–Ag–Cu lead-free solder,” Mater. Sci. Eng. A., 562, 25–32 (2013).

    Article  CAS  Google Scholar 

  4. L. Gao, S. Xue, L. Zhang, Z. Sheng, F. Ji, W. Dai, S.L. Yu, and G. Zeng, “Effect of alloying elements on properties and micro-structures of SnAgCu solders,” Microelectron. Eng., 87, 2025–2034 (2010).

    Article  CAS  Google Scholar 

  5. A.A. El-Daly, A. Fawzy, S.F. Mansour, and M.J. Younis, “Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance,“ Mater. Sci. Eng. A., 578, 62–71 (2013).

  6. A.A. El-Daly, G.S. Al-Ganainy, A. Fawzy, and M.J. Younis, “Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy,” Mater. Des., 55, 837–845 (2014).

    Article  CAS  Google Scholar 

  7. K.M. Kumar, V. Kripesh, and A.A.O. Tay, “Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders,” J. Alloys Compd., 450, 229–237 (2008).

    Article  CAS  Google Scholar 

  8. X. Hu, Y.C. Chan, K. Zhang, and K.C. Yung, “Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis,” J. Alloys Compd., 580, 162–171 (2013).

    Article  CAS  Google Scholar 

  9. J. Liu, C. Andersson, Y. Gao, and Q. Zhai, “Recent development of nano-solder paste for electronics interconnect applications johan,”in: 10th Electronics Packaging Technology Conference (Singapore, 9–12 December, 2008), IEEE (2008), pp. 84–93.

  10. A.A. El-Daly, W.M. Desoky, T.A. Elmosalami, M.G. El-Shaarawy, and A.M. Abdraboh, “Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy,” Mater. Des.65, 1196–1204 (2015).

    Article  CAS  Google Scholar 

  11. G. Chen, F. Wu, C. Liu, V.V. Silberschmidt, and Y.C. Chan, “Micro-structures and properties of new Sn–Ag– Cu lead-free solder reinforced with Ni-coated graphene nanosheets,” J. Alloys Compd., 656, 500–509 (2016).

    Article  CAS  Google Scholar 

  12. O. Mokhtari, A. Roshanghias, R. Ashayer, H.R. Kotadia, F. Khomamizadeh, A.H. Kokabi, M.P. Clode, M. Miodownik, and S.H. Mannan, “Disabling of nanoparticle effects at increased temperature in nanocomposite solders,” J. Electron. Mater., 41,1907–1914 (2012).

    Article  CAS  Google Scholar 

  13. I. Yahya, N. Asikin, A. Ghani, M. Arif, A. Mohd, “Intermetallic evolution between Sn–3.5Ag–1.0Cu–xZn lead free solder and copper substrate under long time thermal aging (x: 0, 0.1, 0.4, 0.7),” in: 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (Ipoh, Malaysia, 6–8 November, 2012), IEEE (2012), pp. 1–6.

  14. X. Wang, Y.C. Liu, C. Wei, H.X. Gao, P. Jiang, and L.M. Yu, “Strengthening mechanism of SiCparticulate reinforced Sn–3.7Ag–0.9Zn lead-free solder,” J. Alloys Compd., 480, 662–665 (2009).

    Article  CAS  Google Scholar 

  15. A.A. El-Daly and A.M. El-Taher, “Improved strength of Ni and Zn–doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters,” Mater. Des., 47, 607–614 (2013).

    Article  CAS  Google Scholar 

  16. A. Kumar, Y.C. Chan, and W.K.C. Yung, “Effect of nano Ni additions on the structure and properties of Sn–9Zn and Sn–Zn–3Bi solders in Au/Ni/Cu ball grid array packages,” Mater. Sci. Eng. B., 162, 92–98 (2009).

    Article  Google Scholar 

  17. A.A. El-Daly, A.E. Hammad, A. Fawzy, and D.A. Nasrallh, “Micro-structure, mechanical properties and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions,” J. Mater., 43, 40–49 (2013).

    Article  CAS  Google Scholar 

  18. M.R. Vaezi, S.K. Sadrnezhaad, and L. Nikzad, “Electrodeposition of Ni–SiC nano-composite coatings and evaluation of wear and corrosion resistance and electroplating characteristics,” Coll. Surf. A., 315, 176–182 (2008).

    Article  CAS  Google Scholar 

  19. E.A. Pavlatou, M. Stroumbouli, P. Gyftou, and N. Spyrellis, “Hardening effect induced by incorporation of SiC particles in Ni electrodeposits,” J. Appl. Electrochem., 36, 385394 (2006).

    Article  CAS  Google Scholar 

  20. A.F. Zimmerman, G. Palumbo, K.T. Aust, and U. Erb, “Mechanical properties of nickel silicon carbide nanocomposites,” Mater. Sci. Eng. A., 328, 137–146 (2002).

    Article  Google Scholar 

  21. Zaki Ahmad, Coatings. Principles of Corrosion Engineering and Corrosion Control, Elsevier (2006), pp. 382–487,

    Book  Google Scholar 

  22. Z. Fathian, A. Maleki, and B. Niroumand, “Niroumand Synthesis and characterization of ceramic nanoparticles reinforced lead-free solder,” Ceram. Int., 43, 5302–5310 (2017).

    Article  CAS  Google Scholar 

  23. S. Nai, J. Wei, M. Gupta, “Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes,” Mater. Sci. Eng. A., 423, 166–169 (2006).

    Article  Google Scholar 

  24. X.L. Zhong, M. Gupta, “Development of lead–free Sn–0.7Cu/Al2O3 nanocomposite solders with superior strength,” J. Physics D: Applied Physics,41, 17 (2008).

    Google Scholar 

  25. L. Zhang and K.N. Tu, “Structure and properties of lead-free solders bearing micro and nano particles,” Mater. Sci. Eng. R., 82, 1–32 (2014).

    Article  Google Scholar 

  26. M. Hasegawa, K. Sugawara, R. Suto, S. Sambonsuge, Y. Teraoka, A. Yoshigoe, S. Filimonov, H. Fukidome, and M. Suemitsu, “In situ SR-XPS observation of Ni-assisted low-temperature formation of epitaxial graphene on 3C-SiC/Si,” Nanoscale Research Lett., 10, 421–426 (2015).

    Article  Google Scholar 

  27. R.M. Said, M.A.A. Mohd Salleh, M.I.I. Ramli, and N. Saud, “Effect of silicon (Si) particles addition on melting temperature, intermetallic compound formation and solderability of Sn–Cu–Ni composite solder paste,” in: Advanced Materials Engineering and Technology V: International Conference on Advanced Material Engineering and Technology (Kaohsiung, Taiwan, 8–9 December, 2016), AIP Conference Proceedings, 1835, No. 1, 020028 (2016).

  28. K.N. Tu and K. Zeng, “Tin ± lead (SnPb) solder reaction in flip chip technology,” Mater. Sci. Eng. R., 34, 1–58 (2001).

    Article  Google Scholar 

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The described article was carried out as part of the GINOP-2.3.2-15-2016-00027 project “Sustainable operation of the workshop of excellence for the research and development of crystalline and amorphous nanostructured materials” project implemented in the framework of the Szechenyi 2020 program. The realization of this project is supported by the European Union.

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Correspondence to Manoj Kumar Pal.

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Published in Poroshkova Metallurgiya, Vol. 58, Nos. 9–10 (529), pp. 44–54, 2019.

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Pal, M.K., Gergely, G., Koncz-Horváth, D. et al. Investigation of the Electroless Nickel Plated Sic Particles in Sac305 Solder Matrix. Powder Metall Met Ceram 58, 529–537 (2020).

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