The behavior of composite C–Cu–C film, which is deposited by dc magnetron sputtering and in which nanosized copper particles are located between two layers of amorphous carbon, is studied during annealing at 600°C in vacuum. The structural evolution is examined by transmission electron microscopy and electron diffraction. The structure of the composite film is found to be stable in annealing up to 15 h. The diffusion coalescence of copper particles is greatly restricted by the specific microstructure of carbon matrix.
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Translated from Poroshkovaya Metallurgiya, Vol. 49, No. 1–2 (471), pp. 66–71, 2010.
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Onoprienko, A.A., Danilenko, N.I. Thermal stability of nanosized composite C–Cu films. Powder Metall Met Ceram 49, 50–54 (2010). https://doi.org/10.1007/s11106-010-9200-1
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DOI: https://doi.org/10.1007/s11106-010-9200-1