Thin carbon–copper layered films are sputtered using a dc magnetron unit. Transmission electron microscopy and electron diffraction are used to examine the structural evolution of the films in annealing at 600°C in vacuum. Two types of films are examined: two-layer carbon–copper and three-layer carbon–copper–carbon films. In annealing, the copper layers disintegrate, ensembles of copper particles form, and diffusion coalescence of particles in the two-layer film is observed. Hence, the density of copper particles decreases and their ensemble-average size increases. The coalescence in the two-layer film is slower than that predicted by theory because of the actual microstructure of quasiamorphous carbon substrate film. In the three-layer film, no coalescence is observed because of the specific morphologic and structural features of copper particles and carbon layers.
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Translated from Poroshkovaya Metallurgiya, Vol. 48, No. 1–2 (465), pp. 119–127, 2009.
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Onoprienko, A.A., Danilenko, N.I. Structural evolution in annealing of layered C–Cu composite films. Powder Metall Met Ceram 48, 93–99 (2009). https://doi.org/10.1007/s11106-009-9089-8
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DOI: https://doi.org/10.1007/s11106-009-9089-8