Optical transceiver with in-chip temperature compensation module design and fabrication

  • Jamshid Sangirov
  • Mohammad Rakib UddinEmail author
  • Gulomjon Sangirov
  • Ikechi Augustine Ukaegbu
  • Tae-Woo Lee
  • Hyo-Hoon Park


An optical transceiver module with in-chip temperature compensation has been implemented using a 0.13 µm complementary metal oxide semiconductor technology to demonstrate stable light emission with temperature variations. The TRx module works up to 6.125 Gbps data rate and achieves a BER of <10−12 with received power of −11 dBm and input power of −8.2 dBm for Tx and Rx, respectively, at room temperature (25 °C). A measured 3-dB bandwidth of 4.05 and 4.75 GHz are obtained for the transmitter and receiver, respectively. For a temperature increase of 25–100 °C, the temperature compensation effectively works for the Tx module with an increased power of 1.2 dB, whereas temperature uncompensated Rx module input power increases to 3.5 dB at 6.125 Gbps and BER of <10−12.


VCSEL power control In-chip temperature sensing Temperature compensation Optical transceiver 


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Copyright information

© Springer Science+Business Media New York 2016

Authors and Affiliations

  • Jamshid Sangirov
    • 1
  • Mohammad Rakib Uddin
    • 2
    Email author
  • Gulomjon Sangirov
    • 3
  • Ikechi Augustine Ukaegbu
    • 1
  • Tae-Woo Lee
    • 1
  • Hyo-Hoon Park
    • 1
  1. 1.Electrical Engineering DepartmentKAISTDaejeonKorea
  2. 2.Electrical and Electronic Engineering Department, Faculty of EngineeringUniversiti Teknologi Brunei (UTB)Bandar Seri BegawanBrunei Darussalam
  3. 3.Info and Comm Engineering DepartmentHarbin Engineering UniversityHarbinChina

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