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Increasing the Conductivity of Sintered Powder Al – Cu Material Due to Electroplating of Aluminium Particles with Copper

  • ADDITIVE TECHNOLOGIES, POWDER AND COMPOSITE MATERIALS
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Metal Science and Heat Treatment Aims and scope

An economical Al – Cu powder with high conductivity has been synthesized by a chemical substitution reaction. The powder particles have the form of an aluminium core, on which a copper shell is deposited. The deposition reaction occurs in a copper sulphate solution at a temperature of 45°C. At higher temperatures, copper diffusion proceeds faster, but the aluminium core may crack. The process of aluminium substitution with copper on the particle surface develops at different values of the standard potential of each metal. The minimum resistivity of 1.01 × 10 – 7 Ω ∙ m is obtained in a composite sintered at 550°C from the Al-core Cu-shell powder with addition of 3 wt.% glass frit. This material can find wide application, for example, as a substitute for silver in electronic devices to reduce production costs.

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Authors and Affiliations

  1. Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan, R.O.C.

    N. G. Puteri, Y. W. Yu & W. H. Lee

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  1. N. G. Puteri
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  2. Y. W. Yu
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  3. W. H. Lee
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Correspondence to W. H. Lee.

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Translated from Metallovedenie i Termicheskaya Obrabotka Metallov, No. 6, pp. 65 – 72, June, 2023.

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Puteri, N.G., Yu, Y.W. & Lee, W.H. Increasing the Conductivity of Sintered Powder Al – Cu Material Due to Electroplating of Aluminium Particles with Copper. Met Sci Heat Treat 65, 386–392 (2023). https://doi.org/10.1007/s11041-023-00942-x

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  • DOI: https://doi.org/10.1007/s11041-023-00942-x

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