The interaction between composite Sn – Cu – Co – Wsolders and the surface of a diamond during the formation of a diamond-bearing layer on an abrasive tool is studied. The components of the solder are shown to affect the wetting of diamond grains and their subsequent retention in the metallic binder.
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Translated from Metallovedenie i Termicheskaya Obrabotka Metallov, No. 6, pp. 28 – 31, June, 2013.
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Artem’ev, V.P., Sokolov, E.G. & Kozachenko, A.D. Study of the Interaction between Composite Solders and Diamond. Met Sci Heat Treat 55, 313–315 (2013). https://doi.org/10.1007/s11041-013-9626-4
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DOI: https://doi.org/10.1007/s11041-013-9626-4