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Using Variations in the Frequency of a Ring Oscillator to Measure the Thermal Resistance of Digital Integrated Circuits

  • THERMAL MEASUREMENTS
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Measurement Techniques Aims and scope

We propose using logic-element time delay as a temperature-sensitive parameter to measure the thermal resistance of digital integrated circuits. We show that the frequency of a ring oscillator constructed using logic elements is inversely proportional to the signal delay time and is a linearly decreasing function of the temperature. We describe a technique for measuring the thermal resistance of a digital integrated circuit as it is heated by its own power consumption.

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Authors and Affiliations

  1. Ulyanovsk Branch, Kotelnikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences, Ulyanovsk, Russia

    V. A. Sergeev & Ya. G. Teten’kin

  2. Ulyanovsk State Technical University, Ulyanovsk, Russia

    V. A. Sergeev

Authors
  1. V. A. Sergeev
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  2. Ya. G. Teten’kin
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Correspondence to V. A. Sergeev.

Additional information

Translated from Izmeritel’naya Tekhnika, No. 2, pp. 46–50, February, 2018.

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Sergeev, V.A., Teten’kin, Y.G. Using Variations in the Frequency of a Ring Oscillator to Measure the Thermal Resistance of Digital Integrated Circuits. Meas Tech 61, 154–160 (2018). https://doi.org/10.1007/s11018-018-1402-9

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  • DOI: https://doi.org/10.1007/s11018-018-1402-9

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