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Measurement of the thermal parameters of semiconductor products using pulse-amplitude modulation of the heating power

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Measurement Techniques Aims and scope

Estimates of the systematic error in measuring a temperature-sensitive parameter of a semiconductor article are obtained. These errors are due to transient electrical and thermal processes which occur when the article is switched from the heating mode to the measurement mode. It is shown that the use of pulse-amplitude modulation of the heating power enables these errors to be reduced considerably.

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Authors and Affiliations

  1. Ulyanovsk Branch, Kotelnikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences, Ulyanovsk, Russia

    V. A. Sergeev & V. V. Yudin

Authors
  1. V. A. Sergeev
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  2. V. V. Yudin
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Correspondence to V. A. Sergeev.

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Translated from Metrologiya, No. 4, pp. 37–47, April, 2010.

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Sergeev, V.A., Yudin, V.V. Measurement of the thermal parameters of semiconductor products using pulse-amplitude modulation of the heating power. Meas Tech 53, 679–685 (2010). https://doi.org/10.1007/s11018-010-9561-3

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  • DOI: https://doi.org/10.1007/s11018-010-9561-3

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