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Experimental evaluation and numerical modeling of adhesion phenomena in polysilicon MEMS

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Abstract

Adhesion phenomena in poly-silicon Micro-Electro-Mechanical Systems (MEMS) are here studied by means of experimental characterization and numerical simulation. In the experimental part, the adhesion energy is measured on-chip by means of on-purpose designed and fabricated devices; moreover, the surface roughness is characterized through the Atomic Force Microscope. For the numerical part, a specific method is developed to simulate the process of adhesion based on a numerical description of surface roughness, on simplified modeling of adhesion forces due to van der Waals and capillary attraction and on non-linear constitutive modeling for polysilicon surfaces.

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Acknowledgements

This work was partially funded by “Fondazione Cariplo” in 2009 within the project “Surface Interactions in Micro and Nano Devices”. The contribution of MIUR with the project PRIN09 “Multi-scale modeling of materials and structures” is also gratefully acknowledged.

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Authors and Affiliations

  1. Department of Civil and Environmental Engineering, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133, Milano, Italy

    Raffaele Ardito, Leonardo Baldasarre, Alberto Corigliano, Biagio De Masi & Attilio Frangi

  2. Department of Chemistry, Materials and Chemical Engineering, Politecnico di Milano, Via Mancinelli, 7, 20131, Milano, Italy

    Luca Magagnin

Authors
  1. Raffaele Ardito
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  2. Leonardo Baldasarre
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  3. Alberto Corigliano
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  4. Biagio De Masi
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  5. Attilio Frangi
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  6. Luca Magagnin
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Correspondence to Alberto Corigliano.

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Ardito, R., Baldasarre, L., Corigliano, A. et al. Experimental evaluation and numerical modeling of adhesion phenomena in polysilicon MEMS. Meccanica 48, 1835–1844 (2013). https://doi.org/10.1007/s11012-013-9767-y

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  • DOI: https://doi.org/10.1007/s11012-013-9767-y

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