Structure and electric resistance of Sn–Cu(Ag) solders in the precrystallization temperature range

We investigate the atomic structure of tin-based solders by X-ray diffraction methods and the reverse Monte Carlo method. Total and partial structural factors and pair correlation functions are calculated. It is shown that Sn0.987Cu0.013 , Sn0.962Ag0.038 , and Sn0.949Ag0.038Cu0.013 liquid alloys are characterized by a microinhomogeneous structure with Cu(Ag)–Sn clusters distributed in the tin-based matrix.

This is a preview of subscription content, access via your institution.

References

  1. 1.

    P. P. Arsent’ev and L. A. Koledov, Metallic Melts and Their Properties [in Russian], Metallurgiya, Moscow (1976).

    Google Scholar 

  2. 2.

    P. S. Popel, M. Calvo-Dahlborg, and U. Dahlborg, “Metastable microheterogeneity of melts in eutectic and monotectic systems and its influence on the properties of the solidified alloy,” J. Non-Crystal. Solids., 353, 3243–3253 (2007).

    Article  CAS  Google Scholar 

  3. 3.

    I. Kaban, W. Hoyer, A. Il’inskii, et al., “Short range order in liquid silver–tin alloys,” J. Non-Crystal. Solids., 331, 254–262 (2007).

    Article  Google Scholar 

  4. 4.

    S. Gruner, I. Kaban, R. Kleinhempel, et al., “Short-range order and atomic clusters in liquid Cu–Sn alloys,” Non-Crystal. Solids., 351, 3490–3496 (2005).

    Article  CAS  Google Scholar 

  5. 5.

    R. L. McGreevy and L. Pusztai, “Reverse Monte Carlo simulation: a new technique for the determination of disordered structures,” Mol. Simul., No. 1, 359–367 (1988).

  6. 6.

    J. M. Ziman, “A theory of the electric properties of liquid metals. I: The monovalent metals,” Philos. Mag., 6, 1013–1034 (1961).

    Article  CAS  Google Scholar 

  7. 7.

    D. M. Kheiker and L. S. Zevin, X-ray Diffractometry [in Russian], Fizmatgiz (1963).

  8. 8.

    D. T. Cromer and J. T. Waber, “Scattering factors computed from relativistic Dirac–Slater wave function,” Acta Cryst., 18, 104–109 (1965).

    Article  CAS  Google Scholar 

  9. 9.

    J. Krogh-Moe, “A method for converting experimental X-ray intensities to an absolute scale,” Acta Cryst., 9, 951–953 (1965).

    Article  Google Scholar 

  10. 10.

    Yu. Plevachuk and V. Sklyarchuk, “Electrophysical measurements for strongly aggressive liquid semiconductors,” Meas. Sci. Technol., 12, 23–26 (2001).

    Article  CAS  Google Scholar 

  11. 11.

    R. L. McGreevy, M. A. Howe, D. A. Keen, and K. N. Clausen, “Reverse Monte Carlo (RMC) simulation: modeling structural disorder in crystals, glasses and liquids from diffraction data,” IOP Conf. Ser., 107,165–184 (1990).

    Google Scholar 

  12. 12.

    N. W. Ashcroft, “Electron–ion pseudopotentials in metals,” Phys. Lett., 23, 48–50 (1966).

    Article  CAS  Google Scholar 

  13. 13.

    J. G. Gasser, J. L. Bretonnet, and A. Bruson, “Temperature dependence of the liquid tin resistivity,” Phys. Status Solidi (b), 128, 789–796 (1985).

    Article  CAS  Google Scholar 

  14. 14.

    A. M. Vora, “Electric transport properties of some liquid metals,” High Temperat., 46, 800–810 (2008).

    Article  CAS  Google Scholar 

  15. 15.

    A. M. Vora, “Electric transport properties of some liquid metals,” Phys. Chem. Liquids, 46, 442–453 (2008).

    Article  CAS  Google Scholar 

  16. 16.

    P. Vashishta and K. S. Singwi, “Electron correlations at metallic densities,” Phys. Rev. B., 6, 875–887 (1972).

    Article  CAS  Google Scholar 

  17. 17.

    Z. Moser, W. Gasior, and J. Pstrus, “Surface tension of liquid Ag-Sn alloys: experiment versus modeling,” J. Phase Equil., 22, 254–258 (2001).

    Article  CAS  Google Scholar 

  18. 18.

    Z. Moser, W. Gasior, K. Bukat, et al. “Pb-free solders: Part1. Wettability testing of Sn–Ag–Cu alloys with Bi additions,” J. Phase Equil. Diffus., 27, 113–139 (2006).

    Google Scholar 

Download references

Author information

Affiliations

Authors

Corresponding author

Correspondence to I. I. Shtablavyi.

Additional information

Translated from Fizyko-Khimichna Mekhanika Materialiv, Vol. 46, No. 4, pp. 35–41, July–August, 2010.

Rights and permissions

Reprints and Permissions

About this article

Cite this article

Mudryi, S.I., Shtablavyi, I.I., Sklyarchuk, V.M. et al. Structure and electric resistance of Sn–Cu(Ag) solders in the precrystallization temperature range. Mater Sci 46, 464 (2011). https://doi.org/10.1007/s11003-011-9313-9

Download citation

Keywords

  • solder
  • atomic structure
  • clusters
  • microinhomogeneous structure