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Cure and thermal decomposition kinetics of a DGEBA/amine system modified with epoxidized soybean oil

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Abstract

In this study, epoxidized soybean oil (ESO) was added to a typical diglycidyl ether of bisphenol A (DGEBA) epoxy resin system with an amine curing agent, and the cure and thermal decomposition kinetics of the epoxy resin system were investigated by thermal analyses. ESO content in the epoxy resin system was changed up to 30%, and the stoichiometric amount of ethylene diamine was used. DSC was used for cure kinetics analysis, and TGA was used for thermal decomposition kinetics analysis. FTIR was used to check the completeness of the polymerization reaction of the cured epoxy resin samples for TGA. With increasing ESO content, cure rate decreased and the beginning temperature of thermal decomposition lowered. The cure and thermal decomposition kinetics of the epoxy resin system could be successfully analyzed by the autocatalytic reaction mechanism and the Ozawa method respectively.

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  1. Department of Chemical Engineering, Chungbuk National University, 1 Chungdaero, Seowongu, Cheongju, Chungbuk, 28644, Korea

    Y. J. Woo & D. S. Kim

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  1. Y. J. Woo
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  2. D. S. Kim
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Correspondence to D. S. Kim.

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Woo, Y.J., Kim, D.S. Cure and thermal decomposition kinetics of a DGEBA/amine system modified with epoxidized soybean oil. J Therm Anal Calorim 144, 119–126 (2021). https://doi.org/10.1007/s10973-020-10159-2

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