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Hydro-thermal performance of normal-channel facile heat sink using TiO2-H2O mixture (Rutile–Anatase) nanofluids for microprocessor cooling

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Abstract

Thermal management of microelectronics is a challenging task in modern high heat generating devices. In this work, thermal performance of normal-channel facile heat sink has been investigated using water and TiO2-H2O (mixture of Rutile and Anatase) nanofluids with volumetric concentration of 0.005% and 0.01%. The maximum reduction in base temperature was noted for TiO2-H2O (∅ = 0.01%) and TiO2-H2O (∅ = 0.005%) as 8.2% and 5.5%, respectively, when compared with water. The thermal performance of normal-channel facile heat sink was then compared with the mini-channel integral fin heat sink. The base temperature of normal-channel facile heat sink was found very close to mini-channel integral fin heat sink with a maximum difference of 1.8%. The total cost to fabricate mini-channel heat sink was almost 5.3 times greater than normal-channel heat sink. So, the normal-channel heat sink has economical advantage over the mini-channel heat sink in terms of lower fabrication cost with similar thermal performance. However, the pressure drop was found greater for normal-channel as compared to mini-channel heat sink. The experimental results of normal-channel facile heat sink were also validated numerically, and a good agreement was found.

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Abbreviations

A :

Active area (mm2)

c :

Center of circle to wall distance (mm)

C :

Specific heat of fluid (kJ kgK−1)

D :

Diameter of circle (mm)

D h :

Hydraulic diameter (mm)

f :

Friction factor

h T :

Height from base to inlet/outlet nozzle (mm)

h :

Convective heat transfer coefficient (W m−2 °C)

H :

Height of fin (mm)

K :

Thermal conductivity of fluid (W mK−1)

L :

Length of facile heat sink (mm)

ṁ :

Mass flow rate (kg s−1)

Nu:

Nusselt number

ΔP :

Pressure drop (Pa)

Q̇ :

Heat transfer rate (W)

R Th :

Thermal resistance (°C W−1)

T b :

Base temperature (°C)

T i :

Fluid inlet temperature (°C)

T o :

Fluid outlet temperature (°C)

ΔT b :

Base temperature drop (°C)

U in :

Inlet velocity (m s−1)

u,v,w :

Velocity in x, y and z axis

V̇ :

Volumetric flow rate (m3 s−1)

w np :

Mass percent of nanoparticles

W :

Width of facile heat sink (mm)

ρ :

Density of fluid (kg m−3)

µnf :

Dynamic viscosity of fluid (kg ms−1)

∅:

Volumetric concentration

CNC:

Computer numerical control

EDM:

Electro-discharge machining

LMTD:

Log of mean temperature difference (°C)

MCIFHS:

Mini-channel integral fin heat sink

NCFHS:

Normal-channel facile heat sink

PEC:

Performance evaluation criteria

act:

Active

h:

Hydraulic

nf:

Nanofluids

np:

Nanoparticles

bf:

Base fluid

b:

Base

i:

Inlet

o:

Outlet

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Authors and Affiliations

  1. Department of Mechanical Engineering, Wah Engineering College, University of Wah, Wah Cantt, Pakistan

    Hussain Ahmed Tariq

  2. Department of Mechanical Engineering, Institute of Space Technology, Islamabad, Pakistan

    Hussain Ahmed Tariq & Muhammad Anwar

  3. College of Earth and Environmental Sciences, University of the Punjab, Lahore, Pakistan

    Abdullah Malik

  4. Mechanical Engineering Department, King Fahd University of Petroleum and Minerals (KFUPM), Dhahran, 31261, Saudi Arabia

    Hafiz Muhammad Ali

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  1. Hussain Ahmed Tariq
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  2. Muhammad Anwar
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  4. Hafiz Muhammad Ali
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Correspondence to Hafiz Muhammad Ali.

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Appendix

Appendix

Uncertainties

$$\frac{{\Delta \dot{Q}}}{{\dot{Q}}} = \left( {\left( {\frac{{\Delta \dot{V}}}{{\dot{V}}}} \right)^{2} + \left( {\frac{\Delta \rho }{\rho }} \right)^{2} + \left( {\frac{\Delta C}{C}} \right)^{2} + \left( {\frac{{\Delta \left( {T_{\text o} - T_{\text i} } \right)}}{{\left( {T_{\text o} - T_{\text i} } \right)}}} \right)^{2} } \right)^{1/2} = 4.2\%$$
$$\frac{{\Delta {\text{LMTD}}}}{\text{LMTD}} = \left( {\left( {\frac{{\Delta \left( {T_{\text{b}} - T_{\text{i}} } \right)}}{{\left( {T_{\text{b}} - T_{\text{i}} } \right)}}} \right)^{2} + \left( {\frac{{\Delta \left( {T_{b} - T_{o} } \right)}}{{\left( {T_{b} - T_{0} } \right)}}} \right)^{2} } \right)^{1/2} = 3.8\%$$
$$\frac{{\Delta D_{\text{h}} }}{{D_{\text{h}} }} = \left( {\left( {\frac{\Delta D}{D}} \right)^{2} } \right)^{1/2} = 0.8\%$$
$$\frac{{\Delta A_{\text{act}} }}{{A_{\text{act}} }} = \left( {\left( {\frac{\Delta DL}{DL}} \right)^{2} + \left( {\frac{\Delta HW}{HW}} \right)^{2} } \right)^{1/2} = 1.1\%$$
$$\frac{\Delta h}{h} = \left( {\left( {\frac{{\Delta \dot{Q}}}{{\dot{Q}}}} \right)^{2} + \left( {\frac{{\Delta \left( {\text{LMTD}} \right)}}{{\left( {\text{LMTD}} \right)}}} \right)^{2} + \left( {\frac{{\Delta A_{\text{act}} }}{{A_{\text{act}} }}} \right)^{2} } \right)^{1/2} = 5.9\%$$
$$\frac{{\Delta R_{\text{Th}} }}{{R_{\text{Th}} }} = \left( {\left( {\frac{{\Delta {\text{LMTD}}}}{\text{LMTD}}} \right)^{2} + \left( {\frac{{\Delta \dot{Q}}}{{\dot{Q}}}} \right)^{2} } \right)^{1/2} = 5.4\%$$

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Tariq, H.A., Anwar, M., Malik, A. et al. Hydro-thermal performance of normal-channel facile heat sink using TiO2-H2O mixture (Rutile–Anatase) nanofluids for microprocessor cooling. J Therm Anal Calorim 145, 2487–2502 (2021). https://doi.org/10.1007/s10973-020-09838-x

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