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Molecular dynamics simulation on explosive boiling of thin liquid argon films on cone-shaped Al–Cu-based nanostructures

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Abstract

The aim of this study is to investigate the effects of Al and Cu nanostructures on the explosive boiling of a thin layer of liquid argon atoms on the Al and Cu substrates using molecular dynamics method. The results indicate that employing cone-shaped nanostructured surfaces leads to creation of thinner primary liquid layer as compared to the common Al or Cu smooth surfaces. Results show that using a cone-shaped nanostructured surface leads to a higher heat transfer rate and subsequently faster evaporating rate of the liquid layers due to increase in the solid–liquid contact area. In addition, it was found that Cu nanostructure has a more effective role in amplifying the explosive boiling, in comparison with Al nanostructure. The results further show that using the Al and Cu cone-shaped nanostructures on an Al smooth surface can increase the heat transfer by 29% and 38.7%, respectively.

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Authors and Affiliations

  1. Automotive Fluids and Structures Analysis Laboratory, School of Automotive Engineering, Iran University of Science and Technology, Tehran, Iran

    Ali Qasemian

  2. Advanced Computational Nanomechanics Laboratory, Department of Mechanical Engineering, Faculty of Engineering, Tehran North Branch, Islamic Azad University, Tehran, Iran

    Mahmoud Qanbarian & Behrouz Arab

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  1. Ali Qasemian
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  2. Mahmoud Qanbarian
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Correspondence to Ali Qasemian.

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Qasemian, A., Qanbarian, M. & Arab, B. Molecular dynamics simulation on explosive boiling of thin liquid argon films on cone-shaped Al–Cu-based nanostructures. J Therm Anal Calorim 145, 269–278 (2021). https://doi.org/10.1007/s10973-020-09748-y

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