Preparation of thermal-enhanced epoxy resin adhesive with organic PCM for applying wood flooring

Abstract

Epoxy resins are well-known materials that show beneficial properties, such as high tensile strength and modulus, good adhesive properties, low cost, and ease of processing and environmental advantages. However, epoxy resin adhesive has no characteristic of thermal storage. Latent heat storage is one of the favorable kinds of thermal energy storage methods considered for energy saving and thermal efficiency in various fields, such as solar air conditioning systems and buildings. So we prepared thermal-enhanced epoxy resin adhesive by using PCM. This paper addresses the effects of n-hexadecane and sodium lauryl sulfate on the thermal properties and chemical properties of epoxy resin adhesive and HEAC, using differential scanning calorimetry, thermal gravimetric analysis, and Fourier transform-infrared spectroscopy. Also, we evaluated the applicability of composite epoxy resin adhesive to wood-based flooring using n-hexadecane, through measurement of bonding strength from universal testing machine analysis.

This is a preview of subscription content, access via your institution.

We’re sorry, something doesn't seem to be working properly.

Please try refreshing the page. If that doesn't work, please contact support so we can address the problem.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

References

  1. 1.

    Tyagi VV, Kaushik SC, Tyagi SK, Akiyama T. Development of phase change materials based microencapsulated technology for buildings: a review. Renew Sustain Energy Rev. 2011;15:1373–91.

    CAS  Article  Google Scholar 

  2. 2.

    Lafontaine LH. Radiant heating and cooling. Heat Pip Air Cond. 1990;62:71–8.

    Google Scholar 

  3. 3.

    Jeong S, Jeon J, Seo J, Lee J, Kim S. Performance evaluation of the microencapsulated PCM for wood-based flooring application. Energ Convers Manag. 2012;64:516–21.

    CAS  Article  Google Scholar 

  4. 4.

    Zhang W, Li X, Fan H, Yang R. Study on mechanism of phosphorus silicon synergistic flame retardancy on epoxy resins. Polym Degrad Stab. 2012;97:2241–8.

    CAS  Article  Google Scholar 

  5. 5.

    Wang X, Hu Y, Song L, Xing WY, Lu HD, Lv P, Jie G. Flame retardancy and thermal degradation mechanism of epoxy resin composites based on a DOPO substituted organophosphorus oligomer. Polymer. 2010;51:2435–45.

    CAS  Article  Google Scholar 

  6. 6.

    Zhang W, Li X, Li L, Yang R. Study of the synergistic effect of silicon and phosphorus on the blowing-out effect of epoxy resin composites. Polym Degrad Stab. 2012;97:1041–8.

    CAS  Article  Google Scholar 

  7. 7.

    Silva LS, Rodríguez JF, Sánchez P. Influence of different suspension stabilizers on the preparation of Rubitherm RT31 microcapsules. Colloids Surf A. 2011;390:62–6.

    Article  Google Scholar 

  8. 8.

    Wang X, Zhang YP, Xiao W, Zeng RL, Zhang QL, Di HF. Review on thermal performance of phase change energy storage building envelope. J China Sci Bull. 2009;54:920–8.

    CAS  Article  Google Scholar 

  9. 9.

    Tomlinson JJ, Kannberg LD. Thermal-energy storage. J Mech Eng. 1990;112:68–72.

    Google Scholar 

  10. 10.

    Tyagi VV, Buddhi D. PCM thermal storage in buildings: a state of art. Renew Sustain Energy Rev. 2007;11:1146–66.

    Article  Google Scholar 

  11. 11.

    Castellon C, Medrano M, Roca J, Cabeza LF, Navarro ME, Fernández AI, Lázaro A, Zalba B. Effect of microencapsulated phase change material in sandwich panels. Renew Energy. 2010;35:2370–4.

    Article  Google Scholar 

Download references

Acknowledgements

This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (2013R1A1A1058448).

Author information

Affiliations

Authors

Corresponding author

Correspondence to Sumin Kim.

Rights and permissions

Reprints and Permissions

About this article

Verify currency and authenticity via CrossMark

Cite this article

Jeong, SG., Cha, J., Kim, S. et al. Preparation of thermal-enhanced epoxy resin adhesive with organic PCM for applying wood flooring. J Therm Anal Calorim 117, 1027–1034 (2014). https://doi.org/10.1007/s10973-014-3862-8

Download citation

Keywords

  • Phase change material
  • Epoxy resin adhesive
  • Thermal properties
  • Heat storage
  • Bonding strength