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Thermal behavior of aromatic polyamic acids and polyimides containing oxadiazole rings

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Abstract

Two aromatic polyimides and the corresponding poly(amic acid)s, with oxadiazole and para/meta phenoxyphenylene rings in the backbone, were synthesized and the structure — thermal properties correlation was followed by dynamic mechanical analysis. Concerning the poly(amic acid)s, the glass transition domain was emphasized only for the compound with meta-oriented rings because the process of imidization takes place with increasing temperature. A multiplex experiment was performed to calculate the activation energy of the transition localized under 200°C. Consecutive heating-cooling-heating cycles were accomplished. All phenomena are discussed by cross-examination of the storage modulus (E′), loss modulus (E″) and loss factor tanδ variation with temperature.

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Authors and Affiliations

  1. Petru Poni’ Institute of Macromolecular Chemistry, Aleea Grigore Ghica Voda 41A, 700487, Iasi, Romania

    Mariana Cristea, Daniela Gheorghiu Ionita, Maria Bruma & B. C. Simionescu

  2. Department of Natural and Synthetic Polymers, ‘Gh. Asachi’ Technical University, 700050, Iasi, Romania

    B. C. Simionescu

Authors
  1. Mariana Cristea
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  2. Daniela Gheorghiu Ionita
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  3. Maria Bruma
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  4. B. C. Simionescu
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Correspondence to Mariana Cristea.

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Cristea, M., Ionita, D.G., Bruma, M. et al. Thermal behavior of aromatic polyamic acids and polyimides containing oxadiazole rings. J Therm Anal Calorim 93, 63–68 (2008). https://doi.org/10.1007/s10973-007-8801-5

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  • DOI: https://doi.org/10.1007/s10973-007-8801-5

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