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Thermal analysis of vinyl siding

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Abstract

Vinyl siding is typically produced by co-extruding a capstock (surface layer) over a PVC substrate formulation. The capstock is often non-PVC, these systems can result in warpage during or after production. In our study we will show that this warpage can result from an interfacial induced stress related to the mismatch between the glass transition of the substrate and the capstock. Additionally, both TMA and TMDSC were used to probe the stress release. Capstock formulations which better match the glass transition of the PVC substrate result in superior performance.

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Correspondence to Judovits L..

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Judovits, L., Crabb, C.C. Thermal analysis of vinyl siding. J Therm Anal Calorim 85, 21–24 (2006). https://doi.org/10.1007/s10973-005-7337-9

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  • DOI: https://doi.org/10.1007/s10973-005-7337-9

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