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Preparation of epoxy-based shape memory polymers for deployable space structures using diglycidyl ether of ethoxylated bisphenol-A

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Abstract

To develop epoxy-based shape memory polymers (ESMPs) with a high switching temperature and good mechanical and shape memory properties for deployable space structures, the crosslink density and chain flexibility of the conventional epoxy resin, diglycidyl ether of bisphenol-A, were controlled by adding a flexible epoxy resin, diglycidyl ether of ethoxylated bisphenol-A with six oxyethylene units (DGEEBA-6). With increasing DGEEBA-6 content, the crosslink density of the ESMPs increased, but their glass transition temperature (Tg) decreased. The ESMPs with suitable switching temperatures (120–135 °C) for deployable space structures showed enhanced toughness, modulus, tensile strength, elongation at break, and shape memory properties. The ESMPs had fast full recovery times of only 80 s at Tg + 20 °C. DGEEBA-6 was shown to be a good modifier of ESMPs for deployable space structures.

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Acknowledgments

This work was supported by the Agency for Defense Development as a collaborative preliminary core technology research project.

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Authors and Affiliations

  1. Deparment of Chemical Engineering, Inha University, Incheon, 22212, Republic of Korea

    Myeong Jun Jo, Howon Choi, Hansol Jang & Ji Ho Youk

  2. Department of Materials Science and Engineering, Seoul National University, Gwanangno, Gwanak-gu, Seoul, 08826, Republic of Korea

    Woong-Ryeol Yu

  3. The 4th R&D Institute-4, Agency for Defense Development, Daejeon, 34186, Republic of Korea

    Miseon Park, Yeontae Kim & Jong Kyoo Park

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  1. Myeong Jun Jo
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  2. Howon Choi
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  8. Ji Ho Youk
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Correspondence to Ji Ho Youk.

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Jo, M.J., Choi, H., Jang, H. et al. Preparation of epoxy-based shape memory polymers for deployable space structures using diglycidyl ether of ethoxylated bisphenol-A. J Polym Res 26, 129 (2019). https://doi.org/10.1007/s10965-019-1801-x

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