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TiO2 and SiO2 filled PTFE composites for microwave substrate applications

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Abstract

TiO2 and SiO2 filled polytetrafluoroethylene (PTFE) composite substrates were fabricated for microwave circuit applications. The total content of TiO2 and SiO2 fillers was a fixed value of 55 wt%, and the content of TiO2 in the PTFE matrix varied from 1 wt% to 9 wt%. The influences of TiO2 filler loading on the microstructure, density, moisture absorption, microwave dielectric properties and coefficient of thermal expansion of filled PTFE composites were investigated. The distribution of filler was uniform throughout the PTFE matrix. The dielectric constant (ε r) showed an increasing trend as the TiO2 content increased, while the dielectric loss (tanδ) decreased up to 5 wt% TiO2 filler loading and then slightly increased till 9 wt% TiO2 loading. Composites showed a similar trend of decreasing moisture absorption, and increasing linear coefficient of thermal expansion (CTE), density as the TiO2 filler content increased. Our results revealed that the TiO2 and SiO2 filled PTFE composites exhibited good dielectric properties (ε r ~ 2.87, tanδ ~ 0.00075), acceptable moisture absorption (0.2 %), CTE (17 ppm/°C) and tensile strength (7.32 MPa) at filler loading of 5 wt% TiO2 and 50 wt% SiO2.

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Acknowledgments

The authors express their sincere appreciation to Materials Analysis Centre, Sichuan University, China, for their support in equipments. This work has been supported by the Fundamental Research Funds for the Central Universities of China (No. ZYGX2012J035).

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Authors and Affiliations

  1. The State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, People’s Republic of China

    Y. Yuan, Y. R. Cui, K. T. Wu, Q. Q. Huang & S. R. Zhang

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  1. Y. Yuan
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  2. Y. R. Cui
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  3. K. T. Wu
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  4. Q. Q. Huang
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  5. S. R. Zhang
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Correspondence to Y. Yuan.

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Yuan, Y., Cui, Y.R., Wu, K.T. et al. TiO2 and SiO2 filled PTFE composites for microwave substrate applications. J Polym Res 21, 366 (2014). https://doi.org/10.1007/s10965-014-0366-y

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  • DOI: https://doi.org/10.1007/s10965-014-0366-y

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