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Cycloaliphatic epoxy resin modified by two kinds of oligo-fluorosiloxanes for potential application in light-emitting diode (LED) encapsulation

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Abstract

Oligo-fluorosiloxane (DFOS) and epoxy-containing oligo-fluorosiloxane (DFEHOS) were synthesized by the hydrolytic condensation reaction to modify 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexanecarboxylate (ERL-4221) for potential application in LED packaging. The chemical structures of DFOS and DFEHOS were characterized by Fourier transform infrared (FT-IR), 29Si nuclear magnetic resonance (29Si NMR), and gel permeation chromatography (GPC). The thermal behavior, mechanical properties, morphologies of impact fracture surfaces, surface wettability and absorbency of the modified epoxy resins were examined by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), tensile and impact testing, scanning electron microscopy (SEM), and contact angle measurement, respectively. The experimental results indicated that the contact angles, surface energies and water absorption ratios of the modified epoxy resins were effectively improved by the introduction of oligo-fluorosiloxanes. Compared to neat epoxy resin, the thermal stabilities of DFEHOS-modified epoxy resins were basically kept, and that of DFOS-modified epoxy resins were slightly depressed with the increasing content of modifiers. As the additive quantity of modifiers was about 5pph to 15pph relative to ERL-4221, good thermal stability, fracture toughness and surface hydrophobicity of the modified epoxy resin was exhibited, and the cured DFEHOS-10 that embraced the relatively optimum comprehensive property was possible for LED encapsulation. Moreover, the reactable groups formed during hydrolytic condensation in DFOS and DFEHOS made good compatibilities between the modifiers and the epoxy matrix.

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Acknowledgments

This work was financially supported by the program of Building Industry Engineering Technology Center at (No. [2008]6-08) and the rolling program of Building Technological Innovation of Modern Industrial Systems for Guangdong province (No. 20101022108), and the authors appreciate the financial support very much.

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Authors and Affiliations

  1. Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, People’s Republic of China

    Nan Gao, WeiQu Liu, SongQi Ma, Chunyi Tang & ZhenLong Yan

  2. Graduate School of Chinese Academy of Sciences, Beijing, 100049, People’s Republic of China

    Nan Gao, SongQi Ma, Chunyi Tang & ZhenLong Yan

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  1. Nan Gao
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  2. WeiQu Liu
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  3. SongQi Ma
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  4. Chunyi Tang
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Correspondence to WeiQu Liu.

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Gao, N., Liu, W., Ma, S. et al. Cycloaliphatic epoxy resin modified by two kinds of oligo-fluorosiloxanes for potential application in light-emitting diode (LED) encapsulation. J Polym Res 19, 9923 (2012). https://doi.org/10.1007/s10965-012-9923-4

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  • DOI: https://doi.org/10.1007/s10965-012-9923-4

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