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Journal of Mathematical Sciences

, Volume 198, Issue 1, pp 75–86 | Cite as

Effect of Partial Closure of an Interface Crack with Heat-conducting Filler and Surface Films in the Case of Thermal Loading of a Bimaterial

  • R. V. Goldstein
  • H. S. Kit
  • R. M. Martynyak
  • Kh. I. Serednytska
Article

We formulate the problem of thermoelasticity for a bimaterial body with interface crack with regard for the contact of its faces in the central part under the action of thermal strains caused by a heat flow perpendicular to the interface. The components of the bimaterial have different heat-conduction coefficients and linear coefficients of thermal expansion. The crack is filled with a heat-conducting medium and its faces have thermal resistance caused by the presence of thin surface films. The problem is reduced to a system of nonlinear singular integrodifferential equations for the jump of temperature between the crack faces and the crack opening displacements. For the solution of this problem, we develop an iterative algorithm based on the method of successive approximations. We analyze the influence of heat flow and thermal resistance of the films on the size of the contact region of the crack faces, crack opening displacements, jump of temperature between the crack faces, and the stress intensity factors for interface stresses.

Keywords

Heat Flow Stress Intensity Factor Thermal Resistance Half Plane Crack Opening Displacement 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2014

Authors and Affiliations

  • R. V. Goldstein
    • 1
  • H. S. Kit
    • 2
  • R. M. Martynyak
    • 1
  • Kh. I. Serednytska
    • 1
  1. 1.Ishlinskii Institute for Problems in MechanicsRussian Academy of SciencesMoscowRussia
  2. 2.Pidstryhach Institute for Problems in Mechanics and MathematicsUkrainian National Academy of SciencesLvivUkraine

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