Abstract
Scheduling in semiconductor manufacturing is of vital importance due to the impact on production performance indicators such as equipment utilization, cycle time, and delivery times. With the increasing complexity of semiconductor manufacturing, ever-new products and demanding customers, scheduling plans for efficient production control become crucial. Scheduling and control are mutually dependent as control requires information from scheduling, for example, where jobs are processed, and scheduling requires control information, for example, on which equipment operations can be processed. Based on a survey of the literature, this article proposes a review and an outlook for the potential improvements by binding scheduling decisions and information coming from advanced process control systems in semiconductor manufacturing.
Similar content being viewed by others
References
Anderson, M., & Hanish, C. K. (2007). An evaluation of the benefits of integrating run-to-run control with scheduling and dispatching systems. IEEE Transactions on Semiconductor Manufacturing, 20(4), 386–392.
Barna, G. G. (1996). APC in the semiconductor industry, history and near term prognosis. In Proceedings of advanced semiconductor manufacturing conference and workshop, Cambridge, (USA) (pp. 364–369).
Besnard, J., Gleispach, D., Gris, H., Ferreira, A., Roussy, A., Kernaflen, C., et al. (2012). Virtual metrology modeling for cvd film thickness. International Journal of Control Science and Engineering, 2(3), 26–33.
Blue, J., Gleispach, D., Roussy, A., & Scheibelhofer, P. (2013). Tool condition diagnosis with a recipe-independent hierarchical monitoring scheme. IEEE Transactions on Semiconductor Manufacturing, 26(1), 82–91.
Boussetta, A., & Cross, A. (2005). Adaptive sampling methodology for in-line defect inspection. In Proceedings of the IEEE/SEMI Advanced Semiconductor Manufacturing Conference, Munich (Germany) (pp. 25–31).
Cai, Y., Kutanoglu, E., Hasenbein, J., & Qin, J. (2009). Single-machine scheduling with advanced process control constraints. Journal of Scheduling. doi:10.1007/s10951-010-0215-8.
Cassady, C. R., & Kutanoglu, E. (2005). Integrating preventive maintenance planning and production scheduling for a single machine. IEEE Transactions on Reliability, 54(2), 304–309.
Chen, A., & Blue, J. (2009). Recipe-independent indicator for tool health diagnosis and predictive maintenance. IEEE Transactions on Semiconductor Manufacturing, 22(4), 522–535.
Chen, A., & Wu, G. S. (2007). Real-time health prognosis and dynamic preventive maintenance policy for equipment under aging markovian deterioration. International Journal of Production Research, 45(15), 3351–3379.
Cheng, F.-T., Huang, H.-C., & Kao, C.-A. (2012). Developing an automatic virtual metrology system. IEEE Transactions on Automation Science and Engineering, 9(1), 181–188.
Cheng, F.-T., Huang, H.-C., & Kao, C.-A. (2007). Dual-phase virtual metrology scheme. IEEE Transactions on Semiconductor Manufacturing, 20(4), 566–571.
Dauzère-Pérès, S., Rouveyrol, J.-L., Yugma, C., & Vialletelle, P. (2010). A smart sampling algorithm to minimize risk dynamically. In Proceedings of the IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (pp. 1078–8743). San Francisco: CA (USA).
Detienne, B., Dauzère-Pérès, S., & Yugma, C. (2012). An exact approach for scheduling jobs with regular step cost functions on a single machine. Computers & Operations Research, 39(5), 1033–1043.
Detienne, B., Dauzère-Pérès, S., & Yugma, C. (2011). Scheduling jobs on parallel machines to minimize a regular step total cost function. Journal of Scheduling, 14(6), 523–538.
Edgar, T. F., Butler, S. W., Campbell, W. J., Pfeiffer, C., Bode, C., Hwang, S. B., et al. (2000). Automatic control in microelectronics manufacturing: Practices, challenges, and possibilities. Automatica, 36(11), 1567–1603.
Engell, S., & Harjunkoski, I. (2012). Optimal operation: scheduling, advanced control and their integration. Computers & Chemical Engineering, 47, 121–133.
Faruqi, A., Goss, R., Adhikari, D., Kowtsch, T. (2008). Test wafer management and automated wafer sorting, In Proceedings of the IEEE/SEMI advanced semiconductor manufacturing conference (pp. 322–326).
Gleispach, D., Blue, J., Roussy, A., Haselmann, M. (2012). Hierarchical monitor scheme for recipe-independent tool condition evaluation. One approach of EHF (Equipment Health Factor). In Proceedings of 12th European advanced process control and manufacturing conference (APCM), Grenoble, France.
Good, P. R., & Purdy, M. A. (2007). An milp approach to wafer sampling and selection. IEEE Transactions on Semiconductor Manufacturing, 20(4), 400–407.
Huang, H.-C., Su, Y.-C., Cheng, F.-T., Jian, J.-M. (2007). Development of a generic virtual metrology framework. In Proceedings of IEEE International Conference on Automation Science and Engineering (CASE), Scottsdale, Arizona, (USA) (pp. 282–287).
Holfeld, A., Barlovic, R., & Good, R. P. (2007). A fab-wide apc sampling application. IEEE Transactions on Semiconductor Manufacturing, 20(4), 393–399.
Johnzèn, C., Vialletelle, P., Dauzère-Pérès, S., Yugma, C., & Derreumaux, A. (2008). Impact of qualification management on scheduling in semiconductor manufacturing. In Proceedings of the winter simulation conference (WSC) (pp. 2059–2066). Miami: Florida (USA).
Johnzèn, C., Dauzère-Pérès, S., & Vialletelle, P. (2011). Flexibility measures for qualification management in wafer fabs. Production Planning and Control, 22(1), 81–90.
Kurz, D., Deluca, C., Pilz, J. (2012). Sampling decision system in semiconductor manufacturing using virtual metrology, In Proceedings of the 8th IEEE international conference on automation science and engineering (case), Seoul (Korea) (pp. 74–79).
Lee, S. B., Lee, T. Y., Liao, J., & Chang, Y. C. (2003). A capacity-dependence dynamic sampling strategy. In Proceedings of the IEEE international symposium on semiconductor manufacturing (pp. 312–314). San Jose: California (USA).
Lensing, K., & Stirton, B. (2007). Perspectives on integrated metrology and wafer-level control. In Proceedings of the international symposium on semiconductor manufacturing (pp. 1–4). California (USA): Santa Clara.
Li, L., & Qiao, F. (2008). The impact of the qual-run requirements of APC on the scheduling performance in semiconductor manufacturing. In Proceedings of the IEEE international conference on automation science and engineering, (CASE) (pp. 242–246). VA (USA): Arlington.
Lynn, S. A., Ringwood, J., & MacGearailt, N. (2012). Global and local virtual metrology models for a plasma etch process. IEEE Transactions on Semiconductor Manufacturing, 25(1), 94–103.
May, G. S., Spanos, C. J. (2006). Fundamentals of semiconductor manufacturing and process control. Hoboken, New Jersey: Wiley (Chap. 6, Chap. 9, pp. 181–227, 333–378).
Mönch, L., Fowler, J. W., Dauzère-Pérès, S., Mason, S. J., & Rose, O. (2011). A survey of problems, solution techniques, and future challenges in scheduling semiconductor manufacturing operations. Journal of Scheduling, 14(6), 583–599.
Moore, G. E. (1965). Cramming more components onto integrated circuits. Electronics, 38(8), 114–117.
Montgomery, D. C. (2009). Introduction to statistical quality control, Chap. 9. Hoboken, New Jersey: Wiley.
Moyne, J. R., & Patel, N. S. (2007). Special section on advanced process control. IEEE Transactions on Semiconductor Manufacturing, 20(4), 343–344.
Nduhura-Munga, J., Rodriguez-Verjan, G., Dauzère-Pérès, S., Yugma, C., Vialletelle, P., & Pinaton, J. (2013). A literature review on sampling techniques in semiconductor manufacturing. IEEE Transactions on Semiconductor Manufacturing, 26(2), 188–195.
Obeid, A., Dauzère-Pérès, S., Yugma, C. (2011). Scheduling job families on parallel machines with a bi-criteria objective function under time constraints. In Proceedings of the multidisciplinary international conference on scheduling: theory and applications (MISTA), Phoenix, Arizona, (USA) (pp. 645–648).
Obeid, A., Dauzère-Pérès, S., Yugma, C. (2012). Scheduling on parallel machines with time constraints and equipment health factors. In Proceedings of the \(8^{th}\) IEEE international conference on automation science and engineering (case 2012), Seoul, (Korea) (pp. 401–406).
Pasadyn, A. J., Lee, H., & Edgar, T. F. (2008). Scheduling semiconductor manufacturing processes to enhance system identification. Journal of Process Control, 18(10), 946–953.
Patel, N. (2000). Control-oriented dispatching in semiconductor manufacturing. In Proceedings of the modeling and analysis of semiconductor manufacturing conference (pp. 61–66). Arizona (USA): Tempe.
Pesotchinsky, L. (1987). Problems associated with quality control sampling in modern ic manufacturing. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 10(1), 107–110.
Purdy, M. (2007). Dynamic, weight-based sampling algorithm. In Proceedings of the international symposium on semiconductor manufacturing (pp. 1–4). California (USA): Santa Clara.
Sarfaty, M., Shanmugasundram, A., Schwarm, A., Paik, J., Zhang, J., Pan, R., Seamons, M. J., Li, H., Hung, R., Parikh, S. (2002). Advance process control solutions for semiconductor manufacturing, In Proceedings of advanced semiconductor manufacturing conference and workshop, Boston, (USA) (pp. 101–106).
SEMATECH. Non-product wafer (NPW) tracking guidelines. http://www.sematech.org/docubase/document/4955aeng.
Stamper, A., Sivaraman, G., Sankar, R. (2012). Advanced excursion control and diagnostics for CMP process monitoring. In Proceedings of the 22nd annual SEMI advanced semiconductor manufacturing conference (ASMC), Saratoga Springs, (USA) (pp. 1–3).
Su, A.-J., Jeng, J.-C., Huang, H.-P., Yu, C.-C., Hung, S.-Y., & Chao, C.-K. (2007). Control relevant issues in semiconductor manufacturing: Overview with some new results. Control Engineering Practice, 15(10), 1268–1279.
Su, Y. C., Lin, T. H., Cheng, F. T., & Wu, W. M. (2004). Making the move to fab-wide apc. Solide State Technology, 47(9), 426–434.
Sun, D.-S., Choung, Y. I., Lee, Y.-J., & Jang, Y.-C. (2005). Scheduling and control for time-constrained processes in semiconductor manufacturing. In Proceedings of the IEEE international symposium on semiconductor manufacturing (pp. 295–298). San Jose: California (USA).
Wein, L. M. (1988). Scheduling semiconductor wafer fabrication. IEEE Transactions on Semiconductor Manufacturing, 1(3), 115–130.
Williams, R., Gudmundsson, D., Monahan, K., & Shanthikumar, J. G. (1999). Optimized sample planning for wafer detect inspection. In Proceedings of the IEEE international symposium on semiconductor manufacturing conference (pp. 43–46). California (USA): Santa Clara.
Yugma, C., Dauzère-Pérès, S., Rouveyrol, J.-L., Vialletelle, P., Pinaton, J., & Relliaud, C. (2011). A smart sampling scheduling and skipping simulator and its evaluation on real data sets. In Proceedings of the winter simulation conference (WSC) (pp. 1903–1912). Arizona (USA): Phoenix.
Acknowledgments
This work constitutes part of the IMPROVE (Implementing Manufacturing science solutions to increase equiPment pROductiVity and fab pErformance) ENIAC European project. In particular, we would like to thank Philippe Vialletelle and Jacques Pinaton from STMicroelectronics for their practical advice.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Yugma, C., Blue, J., Dauzère-Pérès, S. et al. Integration of scheduling and advanced process control in semiconductor manufacturing: review and outlook. J Sched 18, 195–205 (2015). https://doi.org/10.1007/s10951-014-0381-1
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10951-014-0381-1