Journal of Superconductivity and Novel Magnetism

, Volume 31, Issue 8, pp 2291–2295 | Cite as

Single-Grain Bulk YBa2Cu3Oy Superconductors Grown by Infiltration Growth Process Utilizing the YbBa2Cu3Oy + Liquid Phase as a Liquid Source

  • Miryala SushmaEmail author
  • Masato Murakami


The top-seeded infiltration growth (IG) processed YBa2Cu3Oy (Y-123) has several advantages compared to the same material produced by other melt process techniques. There is usually no shrinkage, a limited number of pores, and an uniform secondary phase particle dispersion in the Y-123 matrix. These characteristics of the IG process are very attractive for several industrial applications. In this paper, we produced a large single-grain Y-123 by IG and top seeded melt-growth process. Utilizing commercial YbBa2Cu3Oy (Yb-123) and a homemade Y2BaCuO5 (Y-211), we produced bulk YBa2Cu3Oy samples using Yb-123 + liquid (1:1) as a liquid source. Four facet lines on the top surfaces of the as-grown samples indicated a uniform growth from the seed up to sample edges. Magnetization measurements by SQUID magnetometer showed a sharp superconducting transition with Tc,onset at 92.1 K. The critical current density at 77 K and self-field was 39,000 A/cm2. Trapped field results confirmed that single grain Y-123 samples were produced utilizing the above process. Our results prove that Yb-123 + liquid (1:1) as a liquid source is effective in producing single grain Y-123 material by IG process.


Y-123 IG process Yb-123 + liquid (1:1) Critical current density Trapped field 



Sushma would like to thank the “International High School Internship Program Committee of Shibaura Institute of Technology (SIT)” for selecting her research application at the 2017 Summer Internship Program and providing her an opportunity to work at SIT laboratories. This work was presented in the 10th International Workshop on Processing and Applications of Superconducting (RE)BCO Large Grain Materials (PASREG 2017) and 30th International Symposium on Superconductivity (ISS 2017) as oral presentations and received high recognition within internationally renowned Board Committee as it was awarded with Best Presenter Award and Distinguished Speaker Award.


  1. 1.
    Vaughan, T., DelaBarre, L., Snyder, C., Tian, J., Akgun, C., Srivastava, D., Liu, W., Olson, C., Adriany, G., Strupp, J., Andreson, P., Gopinath, A., Van de Moortele, P.F., Garwood, M., Ugurbill, K.: Magn. Reson. Imaging 56, 1274 (2006)Google Scholar
  2. 2.
    Bednorz, J.G., Müller, K. A: Z. Phys. B 64, 189 (1986)ADSCrossRefGoogle Scholar
  3. 3.
    Wu,M.K., Ashburn, J.R., Torng, C.J., Hor, P.H., Meng, R.L., Gao, L., Huang, Z.H.,Wang, Y.Q., Chu, C.W.: Phys. Rev. Lett. 58, 908 (1987)ADSCrossRefGoogle Scholar
  4. 4.
    Muralidhar, M., Sakai, N., Chikumoto, N., Jirsa, N., Machi, T., Nishiyama, N., Wu, Y., Murakami, M.: Phys. Rev. Lett. 89, 237001 (2002)ADSCrossRefGoogle Scholar
  5. 5.
    Durrell, J.H., Dennis, A.R., Jaroszynski, J., Ainslie,M.D., Palmer, K.G.B., et al.: Supercond. Sci. Technol. 27, 082001 (2014)ADSCrossRefGoogle Scholar
  6. 6.
    Takeda, S.-I., Nishijima, S.: IEEE Trans. Appl. Supercond. 17, 2178 (2007)ADSCrossRefGoogle Scholar
  7. 7.
    Muralidhar, M., Koblischka, M.R., Tomita, M.: Microscopy Book Ser. 5, 1468 (2012)Google Scholar
  8. 8.
    Tomita, M., Fukumoto, Y., Suzuki, K., Ishihara, A., Muralidhar, M.: J. Appl. Phys. 109, 023912 (2011)ADSCrossRefGoogle Scholar
  9. 9.
    Sudhakar Reddy, E., Rajasekharan, T.: Supercond. Sci. Technol. 11, 523 (1998)ADSCrossRefGoogle Scholar
  10. 10.
    Nakazato, K., Muralidhar, M., Koblischka, M.R., Murakami, M.: Cryogenics 63, 129 (2014)ADSCrossRefGoogle Scholar
  11. 11.
    Diko, P., et al.: Supercond. Sci. Technol. 23, 124002 (2010)ADSCrossRefGoogle Scholar
  12. 12.
    Muralidhar, M., Nariki, S., Jirsa, M., Wu, Y., Murakami, M.: Appl. Phys. Lett. 80, 1349 (1998)CrossRefGoogle Scholar
  13. 13.
    Muralidhar, M., Kooblischka, M.R., Saitoh, T., Murakami, M.: Supercond. Sci. Technol. 11, 237001 (2002)Google Scholar
  14. 14.
    Mahmood, A., Jun, B.-H., Han, Y.H., Kim, C.-J.: Supercond. Sci. Technol. 23, 065005 (2010)ADSCrossRefGoogle Scholar
  15. 15.
    Chen, D.X., Goldfarb, R.B.: J. Appl. Phys. 66, 2489 (1989)ADSCrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  1. 1.Superconducting Material Laboratory, Department of Material Science and EngineeringShibaura Institute of TechnologyTokyoJapan
  2. 2.Seisen International SchoolTokyoJapan

Personalised recommendations