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Development for Germanium Blocked Impurity Band Far-Infrared Image Sensors with Fully-Depleted Silicon-On-Insulator CMOS Readout Integrated Circuit

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Abstract

We are developing far-infrared (FIR) imaging sensors for low-background and high-sensitivity applications such as infrared astronomy. Previous FIR monolithic imaging sensors, such as an extrinsic germanium photo-conductor (Ge PC) with a PMOS readout integrated circuit (ROIC) hybridized by indium pixel-to-pixel interconnection, had three difficulties: (1) short cut-off wavelength (120 \(\upmu \)m), (2) large power consumption (10 \(\upmu \)W/pixel), and (3) large mismatch in thermal expansion between the Ge PC and the Si ROIC. In order to overcome these difficulties, we developed (1) a blocked impurity band detector fabricated by a surface- activated bond technology, whose cut-off wavelength is longer than 160 \(\upmu \)m, (2) a fully-depleted silicon-on-insulator CMOS ROIC which works below 4 K with 1 \(\upmu \)W/pixel operating power, and (3) a new concept, Si-supported Ge detector, which shows tolerance to thermal cycling down to 3 K. With these new techniques, we are now developing a \(32 \times 32 \) FIR imaging sensor.

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References

  1. H. Dole et al., Astron. Astrophys. 451, 417 (2006)

  2. H. Murakami et al., PASJ 59, S369 (2007)

    ADS  Google Scholar 

  3. M.W. Werner et al., ApJS 154, 1 (2004)

    Article  ADS  Google Scholar 

  4. G.L. Pibratt et al., Astron. Astrophys. 518, L1 (2010)

    Article  ADS  Google Scholar 

  5. M. Fujiwara et al., Appl. Opt. 42, 2166 (2003)

    Article  ADS  Google Scholar 

  6. T. Nakagawa et al., Proc. SPIE 8442, 84420O (2012)

    Article  Google Scholar 

  7. M.D. Petroff, M.G. Stapelbroek, U.S. Patent 4,568,960, 4 Feb 1986

  8. T. Suga et al., Acta Metall. Mater. 40, S133 (1992)

    Article  Google Scholar 

  9. T. Wada, et al. in IRMMW-THz2010 (2010)

  10. K. Watanabe et al., Jpn. J. Appl. Phys. 50, 015701 (2011)

    Article  ADS  Google Scholar 

  11. H. Kaneda et al., Jpn. J. Appl. Phys. 50, 066503 (2011)

    Article  ADS  Google Scholar 

  12. M. Hanaoka, et al. J. Low Temp. Phys. This Special Issue. doi:10.1007/s10909-016-1484-1

  13. H. Nagata et al., IEEE Trans. Electron Devices 51, 270 (2004)

    Article  ADS  Google Scholar 

  14. P. Merken et al., Proc. SPIE 6275, 627516 (2006)

    Article  Google Scholar 

  15. P. Merken et al., Proc. SPIE 5498, 622–629 (2004)

    Article  ADS  Google Scholar 

  16. H. Nagata et al., AIPC 1185, 286–289 (2009)

    ADS  Google Scholar 

  17. H. Nagata et al., IEICE Trans. Commun. E94–B, 2952 (2011)

    Article  ADS  Google Scholar 

  18. T. Wada et al., J. Low Temp. Phys. 167, 602 (2012)

    Article  ADS  Google Scholar 

  19. K. Nagase, et al., J. Low Temp. Phys. This Special Issue

  20. K. Nagase, T. Wada, et al. in WOLTE-10 (2013)

  21. M. Motoyoshi et al., JINST 10, C03004 (2015)

    Article  Google Scholar 

  22. T. Suzuki et al., PASP 124, 823 (2012)

    Article  ADS  Google Scholar 

  23. T. Wada et al., Appl. Phys. Express 10, 102503 (2010)

    Article  ADS  Google Scholar 

  24. R.R. Reeber, K. Wang, Mater. Chem. Phys. 46, 259 (1996)

    Article  Google Scholar 

  25. P. Goldsmith et al., Proc. SPIE 7010, 701020 (2008)

    Article  Google Scholar 

Download references

Acknowledgments

This work was supported by JSPS KAKENHI Grant Numbers 20244016, 23340053, and 25109005. The authors thank Mitsubishi Heavy Industry Co., Ltd. for their large effort in the fabrication of SAB BIB device. The authors also thank LAPIS Semiconductor Co., Ltd. for their large effort in the fabrication of the FD-SOI CMOS device. The authors thank TDY Inc. and Tohnic Inc. for their support on Ge detector development. The authors thank Tohoku-Microtec Co., Ltd. for their support on micro-cone-shaped Au-bump.

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Wada, T., Arai, Y., Baba, S. et al. Development for Germanium Blocked Impurity Band Far-Infrared Image Sensors with Fully-Depleted Silicon-On-Insulator CMOS Readout Integrated Circuit. J Low Temp Phys 184, 217–224 (2016). https://doi.org/10.1007/s10909-016-1522-z

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  • DOI: https://doi.org/10.1007/s10909-016-1522-z

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