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Erratum to: Journal of Inorganic and Organometallic Polymers and Materials DOI: 10.1007/s10904-006-9037-8
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Submitted August 23, 2005; accepted November 22, 2005
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The online version of the original article can be found at: http://dx.doi.org/10.1007/s10904-006-9037-8
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Chiang, T.H., Hsieh, TE. A Study of Encapsulation Resin Containing Hexagonal Boron Nitride (hBN) as Inorganic Filler. J Inorg Organomet Polym 17, 335 (2007). https://doi.org/10.1007/s10904-007-9105-8
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DOI: https://doi.org/10.1007/s10904-007-9105-8