The thermal properties of a loop thermosyphon made of copper with a horizontally located evaporator, covered by a porous coating, and a condenser intended for cooling powerful electronic devices and transferring heat fluxes with a power of 1 kW and above have been studied. The characteristics of thermosyphon evaporators having capillary structures and liquid- and air-cooled condensers of various types were studied experimentally. It is shown that coating the capillary grooves by a thin layer of sintered powder makes it possible to more than halve the thermal resistance of the thermosyphon evaporator and that, with a condenser cooled by air, the total thermal resistance of the device does not exceed 0.1°C/W.
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Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 96, No. 7, pp. 1739–1747, November–December 2023.
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Vasiliev, L.L., Zhuravlyov, A.S., Kuz′mich, M.A. et al. Loop Thermosyphon for Cooling Heat-Loaded Electronics Components. J Eng Phys Thermophy 96, 1708–1715 (2023). https://doi.org/10.1007/s10891-023-02840-8
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DOI: https://doi.org/10.1007/s10891-023-02840-8