Heat spreaders of different designs made of different materials were investigated. Numerous relations for estimating the optimum thickness and the corresponding thermal resistance of these spreaders with an acceptable accuracy have been obtained. The superiority of certain heat spreaders was demonstrated.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
C. Santos, R. Prieto, P. Vivet, J. P. Colonna, P. Coudrain, and R. Reis, Graphite-based heat spreaders for hotspot mitigation in 3D ICs, Proc. Int. Conf. on the Integratio of 3D Systems (2015), pp. TS10.4.1–TS10.4.4.
B. Jiang, H. Wang, G. Wen, E. Wang, X.Fang, G. Liu, and W. Zhou, Copper–graphite–copper sandwich: Superior heat spreader with excellent heat-dissipation ability and good weldability, RSC Adv., 6, No. 30, Article ID 25128 (2016).
W. Fan, E. Galestien, C. Tomek, and S. Manjunath, Doubling the output of automotive LED headlight with efficient cooling using thermal pyrolytic graphite, Proc. 15th Int. Society Conf. on the Thermal and Thermomechanical Phenomena in Electronic Systems (2016), pp. 180–184.
D. Pinjala, N. Khan, X. Ling, P.-S. Teo, E. H. Wong, M. K. Iyer, C. Lee, and I. J. Rasiah, Thermal design of heat spreader and analysis of thermal interface materials (TIM) for multi-chip package, Proc. 52nd Conf. on Electronic Components and Technology, (2002), pp. 1119–1123.
R. Prieto, J. P. Colonna, P. Coudrain, C. Santos, P. Vivet, S. Cheramy, D. Campos, A. Farcy, and Y. Avenas, Thermal measurements on flip-chipped system-on-chip packages with heat spreader integration, Proc. 31st Thermal Measurement, Modeling & Management Symp., United States (2015), pp. 221–227.
J. Wakil, Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks, Microelectron. Reliab., 46, No. 2–4, 380–385 (2006).
Z. Gao, Y. Zhang, Y. Fu, M. M. F. Yuen, and J. Liu, Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots, Carbon, 61, 342–348 (2013).
R. F. Hill and J. L. Strader, Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader, US Patent, published October (2015).
D. Sabatino and K. Yoder, Pyrolytic graphite heat sinks: A study of circuit board applications, IEEE Trans. Comp. Packag. Manuf. Technol., 4, No. 6, 999–1009 (2014).
F. Falakzaadeh and R. Mehryar, Heat fl ow pattern and thermal resistance modeling of anisotropic heat spreaders, J. Electron. Mater., 46, No. 1, 64–72 (2017).
K. Mizuta, R. Fukuda, T. Nishino, T. Goshima, S. Nii, and T. Asano, Quasi one-dimensional approach to evaluate temperature dependent anisotropic thermal conductivity of a flat laminate vapor chamber, Appl. Therm. Eng., 146, 843–853 (2019).
Author information
Authors and Affiliations
Corresponding author
Additional information
Published in Inzhenerno-Fizicheskii Zhurnal, Vol. 95, No. 3, pp. 676–685, May–June, 2022.
Rights and permissions
About this article
Cite this article
Falakzadeh, F., Mehryar, R. Optimum Thickness of Circular Anisotropic Heat Spreaders. J Eng Phys Thermophy 95, 662–672 (2022). https://doi.org/10.1007/s10891-022-02522-x
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10891-022-02522-x