A study has been made of conditions for the electrochemical deposition of copper on copper plates and of the influence of the microroughness of their surface on the wetting of the plates. This permitted determining the optimum regimes of deposition of coatings on elements of vapor chambers with the aim of creating such elements with controlled wetting properties.
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Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 93, No. 5, pp. 1126–1133, September–October, 2020.
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Voitik, O.L., Delendik, K.I., Kolyago, N.V. et al. Factors Influencing the Characteristics of Wetting of Parts of a Vapor Chamber. J Eng Phys Thermophy 93, 1089–1095 (2020). https://doi.org/10.1007/s10891-020-02209-1
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DOI: https://doi.org/10.1007/s10891-020-02209-1