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Development of Heat Pipes for Cooling Thermally Stressed Electronics Elements

  • HEAT CONDUCTION AND HEAT TRANSFER IN TECHNOLOGICAL PROCESSES
  • Published:
Journal of Engineering Physics and Thermophysics Aims and scope

An algorithm for the development of heat pipes involving the choice of the working fluid, materials for the casing and wick, and the methods of calculating the limits of heat-transmitting ability of heat pipes is suggested. This algorithm has been applied successfully for creating different types of wicks and heat pipes on the basis of which a cooling system has been created for a high-power light-emitting diode lantern.

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Authors and Affiliations

  1. A. V. Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus, 15 P. Brovka Str, 220072, Minsk, Belarus

    K. I. Delendik, N. V. Kolyago, O. G. Penyazkov & O. L. Voitik

Authors
  1. K. I. Delendik
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  2. N. V. Kolyago
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  3. O. G. Penyazkov
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  4. O. L. Voitik
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Corresponding author

Correspondence to N. V. Kolyago.

Additional information

Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 92, No. 6, pp. 2577–2584, November–December, 2019.

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Delendik, K.I., Kolyago, N.V., Penyazkov, O.G. et al. Development of Heat Pipes for Cooling Thermally Stressed Electronics Elements. J Eng Phys Thermophy 92, 1529–1536 (2019). https://doi.org/10.1007/s10891-019-02073-8

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  • DOI: https://doi.org/10.1007/s10891-019-02073-8

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