Abstract
With the rapid development of the 3rd semiconductors, the metal nanoparticles are investigated to be applied in the die-attached interconnect materials. However, the organic solvent used in the nanoparticle paste needs to be addressed. In this work, we adopted the liquid phase reduction method to synthesize Cu–Ag core–shell micro/nano-mixed particles (Cu@Ag MNPs), which achieved better anti-oxidation properties than Cu MNPs. Due to the suitable boiling point and viscosity, the electrical properties and hardness of the sintered films prepared by polyethylene glycol 400 (PEG-400) are better than those of ethylene glycol and α-terpineol. The electrical properties reach 43.82 µΩ cm and the hardness reach 61.3 HV at 300 °C. The shear strength of the joint sintered by Cu@Ag MNPs paste with PEG-400 can reach 20.14 MPa at 300 °C. Besides, the sintered Cu@Ag MNPs film exhibits a denser structure than Ag MNPs and Cu MNPs film. Therefore, Cu@Ag MNPs have great development prospects in the 3rd semiconductors.
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The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.
References
R.T. Yadlapalli, A. Kotapati, R. Kandipati, Int. J. Energy Res. 9, 45 (2021)
B. Zhang, M. Ghassemi, Y. Zhang, IEEE Trans. Dielectr. Electr. Insul. 1, 28 (2021)
Y. Zhang, A. Zubair, Z. Liu, Semicond. Sci. Technol. 5, 36 (2021)
J.Y. Wen, Y.H. Tian, C.J. Hang, Nanomaterials. 9, 960 (2019)
M.Y. LI, Y. Xiao, Z.H. Zhang, ACS Appl. Mater. Interfaces. 7, 9157 (2015)
Y. Zhou, G.M. Zhang, T. Xu, ACS Biomater. Sci. Eng. 6, 2770 (2020)
M.A. Zakaria, A.A. Menazea, A.M. Mostafa, Surf. Interfaces. 19, 100438 (2020)
I.X. Yin, J. Zhang, I.S. Zhao, Int. J. Nanomen. 15, 2555 (2020)
J. Ding, J. Liu, Q.Y. Tian, Nanoscale Res. Lett. 11, 1 (2016)
A. Rantamaki, J. Lindfors, M. Silvennoinen, PTL 25, 1062 (2013)
L. Canham, A. Nassiopoulou, V. Parkhutik, Phys. Status Sulidi A 197, 3 (2003)
X. Yu, J.J. Li, T. Shi, J. Alloy Compd. 709, 700 (2017)
S.C. Fu, Y.H. Mei, G.Q. Lu, Mater. Lett. 128, 42 (2014)
S. Wang, H.J. Ji, M.Y. Li, Mater. Lett. 85, 61 (2012)
S. Wang, M.Y. Li, H.J. Ji, Scripta Mater. 69, 789 (2013)
Y. Akada, H. Tatsumi, T. Yamaguchi, Mater. trans. 49, 1537 (2008)
K. Andritsos, L. Theodorakos, F. Zacharatos, Appl. Surf. Sci. 506, 144968 (2020)
B. Liao, H. Wang, L. Kang, J. Mater. Sci-Mater EL. 32, 5680 (2021)
P. Yi, K. Xiao, C.F. Dong, Bioelectrochemistry. 119, 203 (2018)
K.S. Kim, J.O. Bang, S.B. Jung, Curr. Appl. Phys. 13, S190–S194 (2013)
K.S. Kim, Y.T. Kwon, Y.H. Choa, S.B. Jung, Microelectron. Eng. 106(jun), 27–32 (2013)
R. Riva, C. Buttay, B. Allard, P. Bevilacqua, Microelectron. Reliab. 53(9–11), 1592–1596 (2013)
B.I. Noh, J.W. Yoon, K.S. Kim, Y.C. Lee, S.B. Jung, J. Electron. Mater. 40(1), 35–41 (2011)
C.H. Tsou, K.N. Liu, H.T. Lin, F.Y. Ouyang, J. Electron. Mater. 45(12), 1–7 (2016)
G.Q. Lu, C. Yan, Y.H. Mei, X. Li, Mater. Chem. and Phys. 151, 18–21 (2015)
W.H. Lin, C.H. Tsou, F.Y. Ouyang, J. Mater. Sci-Mater EL. 29(21), 18331–18342 (2018)
Z. Feng, C.R. Marks, A. Barkatt, Oxid. met. 60(5–6), 393–408 (2003)
C.H. Ryu, S.J. Joo, H.S. Kim, Thin Solid Films. 675(APR1), 23–33 (2019)
H.J. Park, Y. Jo, M.K. Cho, Nanoscale. 10, 1039 (2018)
S.J. Joo, M.H. Yu, E.B. Jeon, H.S. Kim, Compos. Sci. and Technol. 142(Apr12), 189–197 (2017)
Y. Gao, W.L. Li, C.T. Chen, H. Zhang, J.T. Jiu, C.F. Li, S. Nagao, K. Suganuma, Mater Des. 160(DEC), 1265–1272 (2018)
E.B. Choi, J.H. Lee, J. Alloys Compd. 689, 952–958 (2016)
S.J. Kim, E.A. Stach, C.A. Handwerker, Appl. Phys. Lett. 96, 144101 (2010)
W.C. Yang, W. Zheng, S.W. Hu, M.Y. Li, Mater. Let. 299, 129781 (2021)
X. Yu, J.J. Li, T.L. She, C.L. Cheng, G.L. Liao, J.H. Fan, T.X. Li, Z.R. Tang, J. Alloys Compd. 724, 365–372 (2017)
Y. Huang, F.S. Wu, Z. Zhou, L.Z. Zhou, H. Liu, Nanotechnology. 31(17) (2020)
M. Grouchko, A. Kamyshny, S. Magdassi, J. Mater. Chem. 19, 3057 (2009)
C. Lee, N.R. Kim, J. Koo, Y.J. Lee, H.M. Lee, Nanotechnology. 26(45), 455601 (2015)
J. Kähler, N. Heuck, G. Palm, A. Stranz, A. Waag, E. Peiner, IEEE 1–7 (2011)
J. Jiu, H. Zhang, S. Koga, S. Nagao, K. Suganuma, J. Mater. Sci-Mater EL. 26, 7183–7191 (2015)
Y.Y. Dai, M.Z. Ng, P. Anantha, Y.D. Lin, Z.G. Li, C.L. Gan, C.S. Tan, Appl. Phys. Lett. 108(26), 263103 (2016)
Y. Mou, J.X. Liu, H. Cheng, Y. Peng, M.X. Chen, Jom. 71, 9 (2019)
K. Suganuma, S. Sakamoto, N. Kagami, S. Soichi, K. Noriko, W. Daisuke, K. Keunsoo, N Masaya Microelectron Reliab. 52, 35–380 (2012)
M. Kuramoto, S. Ogawa, M. Niwa, K.S. Kim, K. Suganuma, IEEE T Comp Pack and Man. 1(5), 653–659 (2011)
D. Tomotoshi, H. Kawasaki, Nanomaterials. 10(9), 1689 (2020)
E.B. Choi, J.H. Lee, Appl. Surf. Sci. 546, 149156 (2021)
W. Liu, H. Wang, K.S. Huang, C.M. Wang, A.T. Wu, J. Taiwan. Inst. Chem. E. 125, 394–401 (2021)
L.J. Guo, W. Liu, C Q. Wang Mater. Lett. 282, 128845 (2021)
L.J. Guo, W. Liu, X.L. Ji, Y. Zhong, C.J. Hang, C.Q. Wang, ACS Appl. Electron. Ma. 4(7), 3457–3469 (2022)
T. Ogura, T. Yagishita, S. Takata, T. Fujimoto, A Hirose Mater. Trans. 54(6), 860–865 (2013)
Q. Gao, W. Zhou, Z.H. Ji, X.B. Wang, Z.D. Xia, F. Guo, ICEPT (2022). https://doi.org/10.1109/ICEPT56209.2022.9873105
Z.Z. Fang, H.T. Wang, X. Wang, V. Kumar, Ceram. Trans. 209, 389 (2010)
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This study was funded by the National Natural Science Foundation of China (Grant No. 61904008), Beijing Municipal Natural Science Foundation (No. KZ202210005002) and National Natural Science Foundation of China (Grant No. 52001013).
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All authors contributed to the study conception and design. Material preparation, data collection and analysis were performed by WZ, ZX, XW, YW, ZY and FG. The first draft of the manuscript was written by QG and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.
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Gao, Q., Zhou, W., Xia, Z. et al. Investigation of ethylene glycol, α-terpineol, and polyethylene glycol 400 on the sintering properties of Cu–Ag core–shell micro/nano-mixed paste. J Mater Sci: Mater Electron 34, 1585 (2023). https://doi.org/10.1007/s10854-023-10965-y
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DOI: https://doi.org/10.1007/s10854-023-10965-y