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In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by Cu6Sn5 nanoparticles

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Abstract

The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped Cu6Sn5 nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, Cu6Sn5 NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing Cu6Sn5 NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of Cu6Sn5 NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of Cu6Sn5 NPs exceeded 0.6 wt%, the catalytic effect of Cu6Sn5 NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of Cu6Sn5 NPs could increase the threshold for instantaneous failure of solder joints under high voltage.

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The data and materials that support the findings of this study are available from the corresponding author upon reasonable request.

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Funding

Funding was provided by Stable Support Program for Higher Education Institutions of Shenzhen (NO. GXWD20220818163456002), Key-Area Research and Development Program of Guangdong Province under Grant (2022B0701180002), CEPREI Innovation and Development Fund (No22Z04), Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory (ZHD202210-016, ZHD202209-018).

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China

    Ziwen Lv, Jintao Wang, Fengyi Wang, Weiwei Zhang, Jianqiang Wang & Hongtao Chen

  2. State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China

    Ziwen Lv, Jintao Wang, Fengyi Wang, Weiwei Zhang, Jianqiang Wang, Fuquan Li & Hongtao Chen

  3. Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China

    Ziwen Lv, Jintao Wang, Fengyi Wang, Weiwei Zhang, Jianqiang Wang & Hongtao Chen

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  1. Ziwen Lv
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Contributions

ZL: Writing—original draft, Visualization. JW: Writing—review, Writing—original draft. FW: Formal analysis, Data curation. WZ: Formal analysis. JW: Methodology. FL: Supervision. HC: Funding acquisition.

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Correspondence to Hongtao Chen.

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Lv, Z., Wang, J., Wang, F. et al. In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by Cu6Sn5 nanoparticles. J Mater Sci: Mater Electron 34, 1469 (2023). https://doi.org/10.1007/s10854-023-10881-1

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