Skip to main content
SpringerLink
Log in

An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

This study developed Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs) to improve the bonding properties of SIPCs with low-melting-point solder (LMPS) fillers. To examine the influence of Cu particle concentration on the bonding properties of Cu-SIPC joints, Cu-SIPCs comprising different Cu particle concentrations in the conductive fillers were formulated, and a bonding test using a quad flat package was conducted. The bonding properties of these joints were measured and compared. The Cu-SIPCs with a Cu particle content of below 10 vol% formed a wide and reliable metallurgical conduction path, with uniformly dispersed Cu particles, due to the proper internal flow and wetting behavior exhibited by molten LMPS fillers. The mechanical bonding strength of the Cu-SIPC joints increased linearly with an increase in the Cu particle content due to the mechanical enhancement effect offered by the Cu particles within the conduction path. However, Cu-SIPCs with excessively high Cu particle concentrations formed weakly shaped conduction paths because of the partly raised viscosity of molten LMPSs and the local agglomeration of Cu particles, which diminished the fluidity of molten LMPSs.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12

Similar content being viewed by others

Data availability

The datasets used or analyzed in this study are available with the corresponding author. They can be produced upon reasonable request.

References

  1. H.K. Kim, F.G. Shi, Microelectron. J. 32, 315–321 (2001)

    Article  CAS  Google Scholar 

  2. D. Wojciechowski, J. Vanfleteren, E. Reese, H.W. Hagedorn, Microelectron. Reliab. 40, 1215–1226 (2000)

    Article  Google Scholar 

  3. Q. Wang, S. Zhang, G. Liu, T. Lin, P. He, J. Alloys Compd. 820, 153184 (2020)

    Article  CAS  Google Scholar 

  4. R. Aradhana, S. Mohanty, S.K. Nayak, Int. J. Adhes. Adhes. 99, 102596 (2020)

    Article  CAS  Google Scholar 

  5. S. Xu, D.A. Dillard, J.G. Dillard, Int. J. Adhes. Adhes. 23, 235–250 (2003)

    Article  CAS  Google Scholar 

  6. Y. Li, C.P. Wong, Mat. Sci. Eng. R 51, 1–35 (2006)

    Article  Google Scholar 

  7. B.S. Yim, S.H. Oh, J.S. Jeong, J.M. Kim, J. Compos. Mater. 47, 1141–1152 (2013)

    Article  Google Scholar 

  8. B.S. Yim, J.I. Lee, Y. Heo, J. Kim, S.H. Lee, Y.E. Shin, J.M. Kim, Mater. Trans. 53, 2104–2110 (2012)

    Article  CAS  Google Scholar 

  9. B.S. Yim, J.I. Lee, B.H. Lee, Y.E. Shin, J.M. Kim, Microelectron. Reliab. 54, 2944–2950 (2014)

    Article  CAS  Google Scholar 

  10. J.W. Baek, K.S. Jang, Y.S. Eom, J.T. Moon, J.M. Kim, J.D. Nam, Microelectron. Eng. 87, 1968–1972 (2010)

    Article  CAS  Google Scholar 

  11. F. Wang, Y. Huang, Z. Zhang, C. Yan, Materials 10, 920 (2017)

    Article  Google Scholar 

  12. F.Q. Hu, Q.K. Zhang, J.J. Jiang, Z.L. Song, Mater. Lett. 214, 142–145 (2018)

    Article  CAS  Google Scholar 

  13. D. Ma, P. Wu, Trans. Nonferrous Met. Soc. China 25, 1225–1233 (2015)

    Article  CAS  Google Scholar 

  14. A.K. Gain, L. Zhang, J. Mater. Sci.: Mater. Electron. 27, 781–794 (2016)

    CAS  Google Scholar 

  15. O. Mokhtari, H. Nishikawa, J. Mater. Sci.: Mater. Electron. 27, 4232–4244 (2016)

    CAS  Google Scholar 

  16. M. McCormack, H.S. Chen, G.W. Kammlott, S. Jin, J. Electron. Mater. 26, 954–958 (1997)

    Article  CAS  Google Scholar 

  17. T. Satoh, T. Ishizaki, M. Usui, Mater. Design 124, 203–210 (2017)

    Article  CAS  Google Scholar 

  18. Y. Liu, H. Zhang, F. Sun, J. Mater. Sci.: Mater. Electron. 27, 2235–2241 (2016)

    CAS  Google Scholar 

  19. F. Guo, J. Mater. Sci: Mater. Electron. 18, 129–145 (2007)

    CAS  Google Scholar 

  20. G.F. Ban, F.L. Sun, J.J. Fan, Y. Liu, S.N. Cong, J. Mater. Eng. Perform. 26, 1069–1075 (2017)

    Article  CAS  Google Scholar 

  21. H.T. Lee, Y.H. Lee, Mater. Sci. Eng. A 419, 172–180 (2006)

    Article  Google Scholar 

  22. H. Rhee, F. Guo, J.G. Lee, K.C. Chen, K.N. Subramanian, J. Electron. Mater. 32, 1257–1264 (2003)

    Article  CAS  Google Scholar 

  23. H. Zhang, Y. Liu, F. Sun, G. Ban, Microelectron. Int. 34, 40–44 (2017)

    Article  Google Scholar 

  24. F. Guo, S. Choi, J.P. Lucas, K.N. Subramanian, J. Electron. Mater. 29, 1241–1248 (2000)

    Article  CAS  Google Scholar 

Download references

Acknowledgements

This research was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No. 2022R1A2C1012409 and No. 2022R1A2C1010405).

Funding

This research did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors.

Author information

Authors and Affiliations

  1. School of Mechanical Engineering, Chung-Ang University, Seoul, 156-756, Korea

    Hee Jun Youn, Jeong Il Lee, Min Jeong Ha & Jong-Min Kim

  2. School of Mechanical System Engineering, Kangwon National University, Gangwon-do, 25913, Korea

    Byung-Seung Yim

Authors
  1. Hee Jun Youn
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jeong Il Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Min Jeong Ha
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Jong-Min Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Byung-Seung Yim
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

HJY contributed to conceptualization, methodology, investigation, and writing the original draft; JIL contributed to visualization and investigation; MJH contributed to visualization and investigation; JMK contributed to supervision and validation; BSY contributed to supervision and validation.

Corresponding authors

Correspondence to Jong-Min Kim or Byung-Seung Yim.

Ethics declarations

Conflict of interest

The authors declare no known competing financial interests or personal relationships that can influence the work reported in this paper.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Youn, H.J., Lee, J.I., Ha, M.J. et al. An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs). J Mater Sci: Mater Electron 34, 886 (2023). https://doi.org/10.1007/s10854-023-10276-2

Download citation

  • Received:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1007/s10854-023-10276-2

Search

Navigation