Abstract
Metal interconnects often require subsequent processing to functionalize metal microstructures in jet printer, 3D printer, and nanoimprint process with nanoparticles. In this paper, the silver acetate ammonia mixed solution was used to infiltrate pseudoplastic metal nanoparticle fluids, and silver acetate was decomposed quickly by microwave to make the interconnect wires. The experimental results show that after 30 min of microwave sintering, the resistivity of the interconnect wires infiltrated by the silver acetate ammonia mixed solution is reduced by 62.9% compared to the interconnect wires only subjected to microwave heat treatment. It takes 75 min to achieve the same resistivity by only microwave sintering.
Similar content being viewed by others
Data availability
All original measurements and data analysis of this work will be available when required.
References
J. Moon, M. Alahbakhshi, A. Gharajeh, Q. Li, Z. Li, R. Haroldson, S. Kwon, R. Hawkins, M.J. Kim, W. Hu, X. Zhang, A. Zakhidov, Q. Gu, ACS Photonics 9, 1984–1991 (2022)
M. Zhu, Y. Xie, J. Shao, Y. Chen, Micro and Nano Eng. 13, 10091 (2021)
Y. Gu, J. Xu, J. Lin, H. Ma, H. Zhao, Y. Zhang, B. Sun, Sol. Energy 241, 172–183 (2022)
G. Ding, Q. Jin, Q. Chen, Z. Hu, J. Liu, Nanoscale Res. Lett. 10, 491 (2015)
P. Wangyang, Y. Gan, Q. Wang, X. Jiang, J. Mater. Chem. C 2, 6140–6147 (2014)
Q. Zhang, D. Sanchez-Fuentes, R. Desgarceaux, P. Escofet-Majoral, J. Oro-Soler, J. Gazquez, G. Larrieu, B. Charlot, A. Gomez, M. Gich, A. Carretero-Genevrier, ACS Appl. Mater. Interfaces 12, 4732–4740 (2020)
Y. Li, M. Kim, M.G. Allen, J. Micromech. Microeng. 28, 027001 (2018)
H. Hillmer, C. Woidt, A. Istock, A. Kobylinskiy, D.T. Nguyen, N. Ahmed, R. Brunner, T. Kusserow, Nanomaterials 11, 164 (2021)
S.R. Deng, B.R. Lu, B.Q. Dong, J. Wan, Z. Shu, J. Xue, Y. Chen, E. Huq, R. Liu, X.-P. Qu, Microelectron. Eng. 87, 985–988 (2010)
M. Kim, D. Lee, T.H. Kim, Y. Yang, H.J. Park, J. Rho, ACS Photonics 6, 2530–2536 (2019)
Y. Chen, Appl. Phys. A 121, 451–465 (2015)
S. Takei, T. Ogawa, R. Deschner, K. Jen, T. Nihira, M. Hanabata, C.G. Willson, Jpn. J. Appl. Phys. 49, 075201 (2010)
S. Takei, T. Ogawa, R. Deschner, C.G. Willson, Microelectron. Eng. 116, 44–50 (2014)
S. Takei, T. Ogawa, R. Deschner, M. Hanabata, C.G. Willson, Micro & Nano Lett. 5, 117–120 (2010)
U. Tahir, J.I. Kim, S. Javeed, A. Khaliq, J.H. Kim, D.I. Kim, M.Y. Jeong, Nanomaterials 12, 480 (2022)
N. Cates, V.J. Einck, L. Micklow, J. Morere, U. Okoroanyanwu, J.J. Watkins, S. Furst, Nanotechnology 32, 155301 (2021)
Q. Zheng, X. Li, Q. Yang, C. Li, L. Wu, Y. Wang, P. Sun, H. Tian, C. Wang, X. Chen, J. Shao, Small Methods 6, e2101539 (2022)
J. Ge, B. Ding, S. Hou, M. Luo, D. Nam, H. Duan, H. Gao, Y.C. Lam, H. Li, Nat. Commun. 12, 3146 (2021)
C.H. Lin, Journal of Micro/Nanolithography. MEMS MOEMS 5, 011003 (2006)
L. Dongxue, S. Yufeng, X. Weiwei, L. Chaoran, W. Wen, W. Pan, D. Zhiyong, RSC Adv. 4, 30402–30411 (2014)
W. Xia, Y. Su, T. Li, C. Liu, D. Li, Z. Duan, RSC Adv. 3, 17851 (2013)
B. Liu, Y. Yu, Z. Hu, M. Li, L. Ma, H. Sun, J. Jia, C. Jiang, Y. Zhong, Y. Chen, Z. Duan, Nanotechnology 33, 275301 (2022)
B. Briscoe, A.C. Smith, J. Phys. D: Appl. Phys. 15, 579–594 (1982)
M.M. Mrokowska, A. Krzton-Maziopa, Sci Rep 9, 7897 (2019)
Y. Kim, G. Kim, J. Lee, Microelectron. Eng. 87, 839–842 (2010)
S.R. Yousefi, H.A. Alshamsi, O. Amiri, M. Salavati-Niasari, J. Mol. Liq. 337, 116405 (2021)
D.M. Elsisi, A. Ragab, A.A. Elhenawy, A.A. Farag, A.M. Ali, Y.A. Ammar, J. Mol. Struct. 1247, 131314 (2022)
M.A. Mahdi, S.R. Yousefi, L.S. Jasim, M. Salavati-Niasari, Int. J. Hydrogen Energy 47, 14319–14330 (2022)
S.R. Yousefi, A. Sobhani, H.A. Alshamsi, M. Salavati-Niasari, RSC Adv 11, 11500–11512 (2021)
X. Hao, X. Wang, S. Zhou, H. Zhang, M. Liu, Mater. Chem. Phys. 215, 327–331 (2018)
F. Zhang, D. Ren, L. Huang, Y. Zhang, Y. Sun, D. Liu, Q. Zhang, W. Feng, Q. Zheng, Adv. Funct. Mater. 31(49), 2107082 (2021)
S.R. Yousefi, O. Amiri, M. Salavati-Niasari, Ultrason. Sonochem. 58, 104619 (2019)
L. Shirmohammadzadeh, H.F. Moafi, A.F. Shojaei, J. Cluster Sci. 33, 1475–1488 (2021)
S.R. Yousefi, M. Masjedi-Arani, M.S. Morassaei, M. Salavati-Niasari, H. Moayedi, Int. J. Hydrogen Energy 44, 24005–24016 (2019)
S.R. Yousefi, D. Ghanbari, M. Salavati-Niasari, M. Hassanpour, J. Mater. Sci.: Mater. Electron. 27, 1244–1253 (2015)
H.H. Hsu, Y.C. Chiu, P. Chiou, C.H. Cheng, J. Alloys Compd. 643, S187–S192 (2015)
C. Du, M. Zhang, Q. Huang, S. Zhang, Y. Chai, Nanoscale 11, 15029–15036 (2019)
Y. Tang, W. He, G. Zhou, S. Wang, X. Yang, Z. Tao, J. Zhou, Nanotechnology 23, 355304 (2012)
Q. Li, M. Li, B. Jia, L. Shangguan, L. Ma, Y. Zhong, Y. Su, Z. Duan, Appl. Phys. Exp. 12(5), 055004 (2019)
N.A. Ulloa-Castillo, O. Martinez-Romero, R. Hernandez-Maya, E. Segura-Cardenas, A. Elias-Zuniga, Materials 14(2), 373 (2021)
B. Jia, Q. Li, L. Ma, M. Li, Y. Zhong, Z. Duan, J. Magn. Magn. Mater. 513, 167232 (2020)
S.P. Sreenilayam, É. Mccarthy, L. Mckeon, O. Ronan, R. Mccann, K. Fleischer, B. Freeland, V. Nicolosi, D. Brabazon, Chem. Eng. J. 449, 137817 (2022)
Funding
The authors would like to thank the National Natural Science Foundation of China (Grant Nos.U1704155, 51175479) and the Ministry of Science and Technology of the People’s Republic of China (G2021026027L).
Author information
Authors and Affiliations
Contributions
BY L contributed to conceptualization, methodology, investigation, validation, formal analysis, visualization, and writing of the original draft. YL Y, DD J, ZN H, LH M, MK L, and YH Z contributed to investigation. ZY D contributed to conceptualization, investigation, and validation.
Corresponding author
Ethics declarations
Conflict of interest
The authors confirm that there is no conflict of interest or competing interest about this work with anybody.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Liu, B., Yu, Y., Jiang, D. et al. Microwave sintering Ag nanoparticle interconnects infiltrated by silver acetate ammonia mixed solution. J Mater Sci: Mater Electron 34, 101 (2023). https://doi.org/10.1007/s10854-022-09548-0
Received:
Accepted:
Published:
DOI: https://doi.org/10.1007/s10854-022-09548-0