Skip to main content
SpringerLink
Log in

Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

A Correction to this article was published on 22 November 2022

This article has been updated

Abstract

Brittle phases are responsible for crack formation and propagation in tin–bismuth (Sn–58Bi) solder material. The purpose of this work is to investigate the effects of various cobalt (Co) nanoparticle (NP) concentrations on the tensile properties of the Sn–58Bi solder matrix. Different aging times were studied to find out the effect of Co NP on ultimate tensile strength. Tin–bismuth solder joints of different Co NP concentrations of 0%, 0.5%, 1%, and 2% were prepared. The reflow process was done at 180 °C for 1 min. Scanning Electron Microscopy and Energy-Dispersive X-ray spectroscopy were used to analyze the solder joints. The tensile test was carried out for the Sn–58Bi and Sn–58Bi–xCo (x = 0.5, 1, and 2) solder joints. The tensile test was run before and after aging time. The tensile results reveal that the addition of Co NP increased the tensile strength significantly at different concentrations of Co NP. The Tensile test revealed that ductility was improved as the temperature was increased. As the aging time increased, the ultimate tensile strength of all samples decreased.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4

Similar content being viewed by others

Data availability

The current study is based on experimental data. In the manuscript, the experimental data were correlated and discussed with existing studies done by other researchers (given in the references). The experimental data of the current study will be provided upon request.

Change history

References

  1. M. Yunus et al., Effect of voids on the reliability of BGA/CSP solder joints. Microelectron. Reliab. 43(12), 2077–2086 (2003)

    Article  Google Scholar 

  2. S.K. Kang, A.K. Sarkhel, Lead (Pb)-free solders for electronic packaging. J. Electron. Mater. 23(8), 701–707 (1994)

    Article  CAS  Google Scholar 

  3. S. Menon et al., High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives. J. Mater. Sci. 26(6), 4021–4030 (2015)

    CAS  Google Scholar 

  4. E. Ringgaard, T. Wurlitzer, Lead-free piezoceramics based on alkali niobates. J. Eur. Ceram. Soc. 25(12), 2701–2706 (2005)

    Article  CAS  Google Scholar 

  5. L.-H. Su et al., Interfacial reactions in molten Sn/Cu and molten In/Cu couples. Metall. Mater. Trans. B 28(5), 927–934 (1997)

    Article  Google Scholar 

  6. S. Choi et al., Effects of Pb contamination on the eutectic Sn-Ag solder joint. Solder. Surf. Mt. Technol. 13(2), 26–29 (2001)

    Article  CAS  Google Scholar 

  7. E. Wood, K. Nimmo, In search of new lead-free electronic solders. J. Electron. Mater. 23(8), 709–713 (1994)

    Article  CAS  Google Scholar 

  8. Z. Mei, J. Morris, Characterization of eutectic Sn-Bi solder joints. J. Electron. Mater. 21(6), 599–607 (1992)

    Article  CAS  Google Scholar 

  9. C. Yang, L. Wang, J. Wang, Fractures of ultra-low-k material in a chip during a flip-chip process. J. Mater. Sci. 33(2), 789–799 (2022)

    CAS  Google Scholar 

  10. S.K. Kang et al., Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications. IBM J. Res. Dev. 49(4/5), 607 (2005)

    Article  CAS  Google Scholar 

  11. K.-K. Xu et al., Review of microstructure and properties of low temperature lead-free solder in electronic packaging. Sci. Technol. Adv. Mater. 21(1), 689–711 (2020)

    Article  CAS  Google Scholar 

  12. H.R. Kotadia, P.D. Howes, S.H. Mannan, A review: on the development of low melting temperature Pb-free solders. Microelectron. Reliab. 54(6–7), 1253–1273 (2014)

    Article  CAS  Google Scholar 

  13. P. Yao, P. Liu, J. Liu, Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu–xNi composite solder joints on electrolytic Ni/Au metallized substrate. J. Alloys Compd. 462(1–2), 73–79 (2008)

    Article  CAS  Google Scholar 

  14. N. Jiang et al., Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder. J. Mater. Sci. 30(19), 17583–17590 (2019)

    CAS  Google Scholar 

  15. Y. Liu, H. Zhang, F. Sun, Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints. J. Mater. Sci. 27(3), 2235–2241 (2016)

    CAS  Google Scholar 

  16. Z. Zhu, Y.-C. Chan, F. Wu. Effects of ZrO 2 nanoparticles on the mechanical properties of Sn 42 Bi 58 solder joint, in 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE. 2015.

  17. L. Yang et al., Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder. J. Electron. Mater. 44(7), 2473–2478 (2015)

    Article  CAS  Google Scholar 

  18. C.W. Lee, Y. Shin, S. Yoo, Effect of SiC nanoparticles dispersion on the microstructure and mechanical properties of electroplated Sn-Bi solder alloy. J. Nano Res. 11, 113–118 (2010)

    Article  CAS  Google Scholar 

  19. Y. Ma et al., Effects of graphene nanosheets addition on microstructure and mechanical properties of SnBi solder alloys during solid-state aging. Mater. Sci. Eng. A 696, 437–444 (2017)

    Article  CAS  Google Scholar 

  20. H. Kang, S.H. Rajendran, J.P. Jung, Low melting temperature Sn-Bi solder: effect of alloying and nanoparticle addition on the microstructural, thermal, interfacial bonding, and mechanical characteristics. Metals 11(2), 364 (2021)

    Article  CAS  Google Scholar 

  21. S. Nai, J. Wei, M. Gupta, Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes. Mater. Sci. Eng. A 423(1–2), 166–169 (2006)

    Article  Google Scholar 

  22. G. Liukui et al., Effect of rare earth Y on microstructure and properties of Sn-58Bi solder alloy. 航空材料学报 38(4), 101–108 (2018)

    Google Scholar 

  23. T.-H. Chuang, H.-F. Wu, Effects of Ce addition on the microstructure and mechanical properties of Sn-58Bi solder joints. J. Electron. Mater. 40(1), 71–77 (2011)

    Article  CAS  Google Scholar 

  24. S. Zhou et al., Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy. Mater. Sci. Eng. A 744, 560–569 (2019)

    Article  CAS  Google Scholar 

  25. B.L. Silva et al., Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys. Mater. Sci. Eng. A 705, 325–334 (2017)

    Article  CAS  Google Scholar 

  26. I. Shafiq, et al. Electro-migration study of nano Al doped lead-free Sn-58Bi on Cu and Au/Ni/Cu ball grid array (BGA) packages, in 18th European Microelectronics & Packaging Conference. IEEE. 2011.

  27. J. Shen et al., Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys. J. Alloys Compd. 614, 63–70 (2014)

    Article  CAS  Google Scholar 

  28. A.K. Gain, L. Zhang, Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder. J. Mater. Sci. 27(1), 781–794 (2016)

    CAS  Google Scholar 

  29. L. Yang et al., Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging. Mater. Sci. Eng. A 667, 368–375 (2016)

    Article  CAS  Google Scholar 

  30. M.N. Bashir, A. Haseeb, Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux. J. Mater. Sci. 29(4), 3182–3188 (2018)

    CAS  Google Scholar 

  31. M.N. Bashir et al., Effect of cobalt doping on the microstructure and tensile properties of lead free solder joint subjected to electro migration. J. Mater. Sci. Technol. 32(11), 1129–1136 (2016)

    Article  CAS  Google Scholar 

  32. M.N. Bashir, A. Haseeb, Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration. J. Mater. Sci. Mater. Electron. 33, 1–9 (2022)

    Article  Google Scholar 

  33. X. Chen et al., Mechanical deformation behavior and mechanism of Sn-58Bi solder alloys under different temperatures and strain rates. Mater. Sci. Eng. A 662, 251–257 (2016)

    Article  CAS  Google Scholar 

  34. R. Kane, B. Giessen, N. Grant, New metastable phases in binary tin alloy systems. Acta Metall. 14(5), 605–609 (1966)

    Article  CAS  Google Scholar 

  35. J. Glazer, Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: a review. J. Electron. Mater. 23(8), 693–700 (1994)

    Article  CAS  Google Scholar 

  36. A. Elements, Bismuth tin alloy (2017), https://www.americanelements.com/bismuth-tin-alloy-12010-55-8. Accessed 27 Mar 2022

Download references

Acknowledgements

The financial support was provided by City, University of London, United Kingdom and University of Malaya, Kuala Lumpur, Malaysia.

Funding

This work received support from University of Malaya (MY), Grant No. D000026-16001.

Author information

Authors and Affiliations

  1. National University of Sciences and Technology, Islamabad, Pakistan

    M. Nasir Bashir & Hafiz Muhammad Saad

  2. Department of Metallurgical Engineering, Faculty of Chemical and Process Engineering NEDUET, Karachi, Pakistan

    Muhammad Rizwan & Iftikhar Ahmed Channa

  3. Department of Mechanical Engineering, Dicle University, Diyarbarkir, Turkey

    Sedat Bingöl

  4. Mechanical Engineering Department, Faculty of Engineering and Technology, Bahauddin Zakariya University, Multan, Pakistan

    Mustabshirha Gul

  5. Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia

    A. S. M. A. Haseeb

  6. Department of Mechanical Engineering and Aeronautics, City, University of London, London, UK

    Sumsun Naher

Authors
  1. M. Nasir Bashir
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hafiz Muhammad Saad
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Muhammad Rizwan
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Sedat Bingöl
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Iftikhar Ahmed Channa
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Mustabshirha Gul
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. A. S. M. A. Haseeb
    View author publications

    You can also search for this author in PubMed Google Scholar

  8. Sumsun Naher
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

All authors have equal contribution.

Corresponding authors

Correspondence to A. S. M. A. Haseeb or Sumsun Naher.

Ethics declarations

Conflict of interest

The authors have no relevant financial interests to disclose.

Ethical approval

The authors followed the ethical standards during the experiments as well as during the preparation of the manuscript.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Nasir Bashir, M., Saad, H.M., Rizwan, M. et al. Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint. J Mater Sci: Mater Electron 33, 22573–22579 (2022). https://doi.org/10.1007/s10854-022-09035-6

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-022-09035-6

Search

Navigation