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Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

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Abstract

Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.

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Data availability

The current study is based on experimental data. In manuscript, the experimental data was correlated and discussed with existing studies done by other researchers (given in the references). The experimental data of current study is unpublished and will be provided for the evidence and for the review.

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Acknowledgements

The financial support was provided by City, University of London, United Kingdom and University of Malaya, Kuala Lumpur, Malaysia.

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The authors have not disclosed any funding.

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Authors and Affiliations

  1. National University of Sciences and Technology, Islamabad, Pakistan

    M. Nasir Bashir & Hafiz Muhammad Saad

  2. Department of Metallurgical Engineering NEDUET, Karachi, Pakistan

    Muhammad Rizwan

  3. Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, 26600, Pekan, Pahang, Malaysia

    M. M. Quazi

  4. Centre for Mathematical Modelling and Intelligent Systems for Health and Environment (MISHE), Atlantic Technological University Sligo, Ash Lane, Sligo, F91 YW50, Ireland

    Muhammad Mahmood Ali

  5. Department of Mechanical Engineering, Comsats University Islamabad, Wah campus, Wah Cantt, Rawalpindi, Pakistan

    Arslan Ahmed

  6. Department of Mechanical Engineering, Faculty of Engineering Sciences and Technology, Hamdard University, Karachi, 74600, Pakistan

    Asad A. Zaidi

  7. Department of Mechanical Engineering, University Centre for Research & Development, Chandigarh University, Mohali, Punjab, 140413, India

    Manzoore Elahi M. Soudagar

  8. Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia

    A. S. M. A. Haseeb

  9. Department of Mechanical Engineering and Aeronautics, University of London, London, UK

    Sumsun Naher

Authors
  1. M. Nasir Bashir
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  2. Hafiz Muhammad Saad
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  4. M. M. Quazi
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  6. Arslan Ahmed
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  7. Asad A. Zaidi
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  8. Manzoore Elahi M. Soudagar
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  9. A. S. M. A. Haseeb
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  10. Sumsun Naher
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All authors contributed equally.

Corresponding authors

Correspondence to A. S. M. A. Haseeb or Sumsun Naher.

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Bashir, M.N., Saad, H.M., Rizwan, M. et al. Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint. J Mater Sci: Mater Electron 33, 22499–22507 (2022). https://doi.org/10.1007/s10854-022-09028-5

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