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Heat-resistant and electrical properties of bismaleimide modified epoxy resin

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Abstract

The ever-increasing development of power modules requires epoxy (EP) encapsulants to have excellent heat-resistance capability. Many studies have been conducted on improving the heat-resistance of epoxy encapsulants and have made important achievements in recent years. However, the electrical insulation of the EP-based high heat-resistance materials has not been paid enough attention and less studied. In this paper, BMI/EP systems have been prepared, and the electrical characteristics and heat-resistance of the modified BMI/EP have been investigated. Dynamic thermomechanical analysis shows the introduction of BMI greatly improves the heat-resistance of the epoxy systems. The electrical conductivity and breakdown characteristics of BMI/EP samples were measured at 30, 50, and 70 °C, respectively. The analysis of space charge indicates the trap distribution in the 10%BMI can significantly suppress carrier migration, resulting in the highest electric breakdown strength and the lowest current density. The excellent insulation properties with improved heat-resistance demonstrate that BMI/EP has great potential to be used in power modules.

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Data availability

The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (Nos. U20A20308, 51977050, 52007042), Natural Science Foundation of Heilongjiang Province (No. TD2019E002), China Postdoctoral Science Foundation (Nos. 2021T140166, 2018M640303), Youth Innovative Talents Training Plan of Ordinary Undergraduate Colleges in Heilongjiang (Nos. UNPYSCT-2020178, UNPYSCT-2020180). Tiandong Zhang acknowledges the support from the China Scholarship Council (CSC).

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Authors and Affiliations

  1. Key Laboratory of Engineering Dielectric and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin, 150080, People’s Republic of China

    Qingguo Chi, Xiaowen Zhang, Changhai Zhang, Yu Feng, Chao Tang, Zhonghua Li & Tiandong Zhang

  2. School of Electrical & Electronic Engineering, Harbin University of Science and Technology, Harbin, 150080, People’s Republic of China

    Qingguo Chi, Xiaowen Zhang, Changhai Zhang, Yu Feng, Chao Tang, Zhonghua Li & Tiandong Zhang

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  1. Qingguo Chi
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  2. Xiaowen Zhang
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  3. Changhai Zhang
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All authors contributed to the study conceptualization, methodology, preparation, investigation, data analysis, writing of original draft, reviewing, and editing.

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Correspondence to Changhai Zhang or Tiandong Zhang.

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Chi, Q., Zhang, X., Zhang, C. et al. Heat-resistant and electrical properties of bismaleimide modified epoxy resin. J Mater Sci: Mater Electron 33, 17868–17876 (2022). https://doi.org/10.1007/s10854-022-08650-7

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  • DOI: https://doi.org/10.1007/s10854-022-08650-7

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