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Investigation of Sn–Bi–In ternary solders with compositions varying from Sn–Bi eutectic point to 76 °C ternary eutectic

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Abstract

The solder properties of Sn–Bi–In ternary solders of seven different compositions are examined. The compositions are systematically chosen from the liquidus line extending from the Sn–Bi eutectic point to the ternary eutectic point at 76 °C. Using CALPHAD, we acquire information on the vertical-section of the phase diagram and other thermodynamic information such as pasty zone [liquidus temperature (Tliquidus) − solidus temperature (Tsolidus)] for each composition. DSC data obtained from the solder powders show the evolution of several endothermic peaks roughly consistent with the prediction of the phase diagrams. Solder balling testing indicates that the sample of the Sn–Bi eutectic composition forms a single ball whereas other samples, with a wide pasty zone, show the presence of small satellite balls. Microstructure analysis on the reflowed solder balls using scanning electron microscopy discloses that the ternary solder balls are composed of β-Sn, Bi, and BiIn phases. Shear test results indicate that the shear strength of the solders ranges between 41 and 63 MPa.

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The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

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Acknowledgements

This work was supported by the Technology Innovation Programs (10080746 and 2000352) funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea).

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Author notes

  1. Sung-Ryul Mang and Hoon Choib equally contributed to this work.

Authors and Affiliations

  1. SKKU Advanced Institute of Nano Technology, Sungkyunkwan University, Suwon, 16419, Republic of Korea

    Sung-Ryul Mang & Hoo-Jeong Lee

  2. Department of Smart Fab. Technology, Sungkyunkwan University, Suwon, 16419, Republic of Korea

    Hoon Choi & Hoo-Jeong Lee

Authors
  1. Sung-Ryul Mang
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  2. Hoon Choi
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  3. Hoo-Jeong Lee
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All authors have contributed equally.

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Correspondence to Hoo-Jeong Lee.

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Mang, SR., Choi, H. & Lee, HJ. Investigation of Sn–Bi–In ternary solders with compositions varying from Sn–Bi eutectic point to 76 °C ternary eutectic. J Mater Sci: Mater Electron 33, 17453–17461 (2022). https://doi.org/10.1007/s10854-022-08571-5

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  • DOI: https://doi.org/10.1007/s10854-022-08571-5

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