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Microstructure evolution of diamond with molybdenum coating and thermal conductivity of diamond/copper composites fabricated by spark plasma sintering

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Abstract

Molybdenum (Mo) coating was deposited on the diamond surface by vacuum micro-vapor deposition. Effects of deposition parameters on the formation of Mo coating on the diamond different crystal face was investigated. The mechanism of diamond metallization evolution, fracture mode and thermal conductivity of diamond/copper composites were discussed. It is shown that the coating of diamond particles is starting with point-like particles grew up to be continuous, dense spherical coating, and the compactness of the coating on diamond <100> facet always takes precedence over diamond <111> facet. The Mo coating on the diamond surface deposited at 1050 °C for 50 min shows the best quality. The fracture modes of Mo-coated diamond/copper composites are composed of diamond debonding from copper matrix, diamond transgranular fracture and copper ductile fracture, but some pores existed at the interfere, it concludes that the Mo2C prepare a Cu/Mo/diamondinterlayer between the diamond and copper matrix could improve the bonding between diamond and copper matrix, but the effect of Mo2C coating on strengthen the interfacial bonding is limited. The highest thermal conductivity of the composites achieved the value of 329 W/(m K).

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Funding

This was supported by the National Natural Science Foundation of China (Grant No. 52075250), the China Postdoctoral Science Foundation (Grant No. 2020M683376) and State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Grant No. AWJ-22M13), the Fundamental Research Funds for the Central Universities (Grant No. NT2021018).

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Authors and Affiliations

  1. National Key Laboratory of Science and Technology on Helicopter Transmission, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

    Hongzhao Li, Changrui Wang, Tian Wei, Junshan Hu, Chao Wu, Minghe Chen & Wenhe Liao

  2. College of Materials Science and Engineering, Heilongjiang University of Science and Technology, Harbin, 150022, China

    Wei Ding

  3. Beijing Institute of Electronic System Engineering, Beijing, 100854, China

    Lianmei Wu & Junbo Wang

  4. Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China

    Hao Zhang

  5. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China

    Tiesong Lin

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  1. Hongzhao Li
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  2. Changrui Wang
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  3. Wei Ding
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  4. Lianmei Wu
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Contributions

HL: done experiments and wrote the manuscript, CW: modified the structure of manuscript, WD: modified the grammar of manuscript and improved the English erros, TW, JH, CW and MC: guided and assisted the work of experiment, HZ, TL, WL modified the structure of manuscript, WD modified and improvd the overall quality of the manuscript.

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Correspondence to Changrui Wang, Lianmei Wu or Hao Zhang.

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Li, H., Wang, C., Ding, W. et al. Microstructure evolution of diamond with molybdenum coating and thermal conductivity of diamond/copper composites fabricated by spark plasma sintering. J Mater Sci: Mater Electron 33, 15369–15384 (2022). https://doi.org/10.1007/s10854-022-08441-0

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