Skip to main content
SpringerLink
Log in

Influence of Cu powders on the wettability and mechanical properties of solderable epoxy composites

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

A Cu powder-filled solderable epoxy composite (Cu-SEC), in which Cu powders were applied as reinforcement materials, was developed to enhance the mechanical properties of solderable epoxy composite (SEC) joints. To clarify the influence of the Cu powder content on the wettability and mechanical properties of SECs, four types of Cu-SECs with different Cu powder concentrations in the metal fillers (from 0 to 20 vol%) were synthesized, and two types of wetting tests (i.e., planar and line metallization wetting tests), and microhardness tests were conducted. The Cu-SECs for which the Cu powders content less than a certain value (10 vol%) exhibited proper wettability with a reasonable wetting angle and spreading shapes to the Cu metallization in a planar metallization wetting test, and showed excellent selective wetting properties with a uniform and stable selectively wetted conductive path morphologies in a line metallization wetting test. The microhardness of the Cu-SEC joints increased with the increasing Cu powder content due to the strengthening effect of the uniformly distributed Cu powders within the wetted low-melting-point solder (LMS) filler. However, the wettability and selective wetting properties of the molten LMS deteriorated as the Cu powder content increased to more than a certain value because of the partially increased viscosity and reduced fluidity of the fused LMS.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

Data availability

The datasets used or analyzed during the current study are available from the corresponding author on reasonable request.

References

  1. Q. Wang, S. Zhang, G. Liu, T. Lin, P. He, J. Alloys Compd. 820, 153184 (2020)

    Article  CAS  Google Scholar 

  2. Z. Wu, J. Li, D. Timmer, K. Lozano, S. Bose, Int. J. Adhes. Adhes. 29, 488–494 (2009)

    Article  Google Scholar 

  3. Y. Li, C.P. Wong, Mat. Sci. Eng. R 51, 1–35 (2006)

    Article  Google Scholar 

  4. S. Xua, D.A. Dillarda, J.G. Dillard, Int. J. Adhes. Adhes. 23, 235–250 (2003)

    Article  Google Scholar 

  5. B.S. Yim, S.H. Oh, J.S. Jeong, J.M. Kim, J. Compos. Mater. 47, 1141–1152 (2013)

    Article  Google Scholar 

  6. B.S. Yim, J.I. Lee, Y. Heo, J. Kim, S.H. Lee, Y.E. Shin, J.M. Kim, Mater. Trans. 53, 2104–2110 (2012)

    Article  CAS  Google Scholar 

  7. B.S. Yim, J.I. Lee, B.H. Lee, Y.E. Shin, J.M. Kim, Microelectron. Reliab. 54, 2944–2950 (2014)

    Article  CAS  Google Scholar 

  8. F. Wang, Y. Huang, Z. Zhang, C. Yan, Materials 10, 920 (2017)

    Article  Google Scholar 

  9. N.M. Poon, C.M.L. Wu, J.K.L. Lai, Y.C. Chan, IEEE Trans. Adv. Packag. 23, 708–714 (2000)

    Article  CAS  Google Scholar 

  10. A.K. Gain, L. Zhan, J. Mater. Sci. Mater. Electron. 27, 781–794 (2016)

    Article  CAS  Google Scholar 

  11. Y. Li, Y.C. Chan, J. Alloys Compd. 645, 566–576 (2015)

    Article  CAS  Google Scholar 

  12. N. Jiang, L. Zhang, Z. Liu, L. Sun, M. Xiong, M. Zhao, K. Xu, J. Electron. Mater. 30, 17583–17590 (2019)

    Article  CAS  Google Scholar 

  13. X. Zhong, X. Yang, K. Ruan, J. Zhang, H. Zhang, J. Gu, Macromol. Rapid Commun. 43, 2100580 (2022)

    Article  CAS  Google Scholar 

  14. K. Ruan, X. Zhong, X. Shi, J. Dang, J. Gu, Mater. Today Phys. 20, 100456 (2021)

    Article  CAS  Google Scholar 

  15. H. Zhang, Y. Liu, F. Sun, G. Ban, Microelectron. Int. 34, 40–44 (2017)

    Article  Google Scholar 

  16. F. Guo, S. Choi, J.P. Lucas, K.N. Subramanian, J. Electron. Mater. 29, 1241–1248 (2000)

    Article  CAS  Google Scholar 

  17. Y. Liu, H. Zhang, F. Sun, J. Mater. Sci. : Mater. Electron. 27, 2235–2241 (2016)

    CAS  Google Scholar 

  18. J. Sitek, K. Bukat, Proceedings of 28th International Spring Seminar on Electronics Technology Conference on IEEE, pp. 84–89 (2005)

  19. F. Guo, J. Mater. Sci: Mater. Electron. 18, 129–145 (2007)

    CAS  Google Scholar 

  20. H. Rhee, F. Guo, J.G. Lee, K.C. Chen, K.N. Subramanian, J. Electron. Mater. 32, 1257–1264 (2003)

    Article  CAS  Google Scholar 

  21. G.F. Ban, F.L. Sun, J.J. Fan, Y. Liu, S.N. Cong, J. Mater. Eng. Perform. 26, 1069–1075 (2017)

    Article  CAS  Google Scholar 

Download references

Acknowledgments

This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and future Planning (Grant No. 2017R1C1B5076997) and the Korea government (MSIT) (Grant No. 2020R1F1A1075165).

Funding

This research did not receive any specific grant from funding agencies in the public, commercial, or not- for-profit sectors.

Author information

Authors and Affiliations

  1. School of Mechanical Engineering, Chung-Ang University, Seoul, 156-756, Korea

    Hee Jun Youn, Jeong Il Lee & Jong-Min Kim

  2. School of Mechanical System Engineering, Kangwon National University, Gangwon-do, 25913, Korea

    Byung-Seung Yim

Authors
  1. Hee Jun Youn
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jeong Il Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Jong-Min Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Byung-Seung Yim
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

HJY: conceptualization, methodology, investigation, writing-original draft. JIL: visualization, investigation. JMK: supervision, validation. BSY: supervision, validation.

Corresponding authors

Correspondence to Jong-Min Kim or Byung-Seung Yim.

Ethics declarations

Conflict of interest

The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Additional information

Publisher’s Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Youn, H.J., Lee, J.I., Kim, JM. et al. Influence of Cu powders on the wettability and mechanical properties of solderable epoxy composites. J Mater Sci: Mater Electron 33, 10030–10041 (2022). https://doi.org/10.1007/s10854-022-07994-4

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-022-07994-4

Search

Navigation