Abstract
In this study, NiFe/Cu multilayer structures were fabricated using a sputtering method. The electromagnetic interference shielding effectiveness (EMI SE) of symmetrical and asymmetric structures of 4 μm NiFe/Cu multilayers was evaluated to optimize their performance. In addition to the number of layers, a decrease in the electrical conductivity of each Cu layer led to a decrease in the EMI SE. In the multilayer structure with a 100 nm NiFe layer, an EMI SE ranging from − 75 to − 73 dB was obtained in the wideband owing to the increase in the thickness of each Cu layer within the multilayer. In contrast, when the thickness of the NiFe layers was 500 nm, the improvement in the EMI SE was negligible owing to the decrease in the electrical conductivity difference between the NiFe and Cu layers.
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References
N. Chikyu, T. Nakano, G. Kletetschka, Y. Inoue, Mater. Des. 195, 108918 (2020)
B. Zhao, M. Hamidinejad, S. Wang, P. Bai, R. Che, R. Zhang, C.B. Park, J. Mater. Chem. A 9, 8896 (2021)
G.H. Lim, N. Kwon, E. Han, S. Bok, S.E. Lee, B. Lim, J. Ind. Eng. Chem. 93, 245 (2021)
A.O. Watanabe, P.M. Raj, D. Wong, R. Mullapudi, R. Tummala, J. Electron. Mater. 47, 5243 (2018)
J.H. Park, J.W. Lee, H.J. Choi, W.G. Jang, T.S. Kim, D.S. Suh, H.Y. Jeong, S.Y. Chang, J.C. Roh, C.S. Yoo, K.H. Kim, C. Park, S.J. Suh, Thin Solid Films 677, 130 (2019)
Henry W. Ott Electromagnetic Compatibility Engineering
F. Fang, Y.Q. Li, H.M. Xiao, N. Hu, S.Y. Fu, J. Mater. Chem. C 4, 4193 (2016)
Z. Dou, G. Wu, X. Huang, D. Sun, L. Jiang, Compos. Part A 38, 186 (2007)
H. Zhao, L. Hou, S. Bi, Y. Lu, ACS Appl. Mater. Interfaces 9, 33059 (2017)
J. Joo, C.Y. Lee, J. Appl. Phys. 88, 513 (2000)
Z. Yang, H. Peng, W. Wang, T. Liu, J. Appl. Polym. Sci. 116, 2658 (2010)
J.-H. Park, S. Lee, J. Chul Ro, S.-J. Suh, Appl. Surf. Sci. 573, 151469 (2022)
D. Wanasinghe, F. Aslani, Compos. B 176, 107207 (2019)
B. Zhao, J. Deng, C. Zhao, C. Wang, Y.G. Chen, M. Hamidinejad, R. Li, C.B. Park, J. Mater. Chem. C 8, 58 (2020)
M. Hamidinejad, B. Zhao, A. Zandieh, N. Moghimian, T. Filleter, C.B. Park, ACS Appl. Mater. Interfaces 10, 30752 (2018)
Z. Xu, H. Hao, J. Alloys Compd. 617, 207 (2014)
P.S. Liu, H.B. Qing, H.L. Hou, Y.Q. Wang, Y.L. Zhang, Mater. Des. 92, 823 (2016)
Z.-H. Zhou, Y. Liang, H.-D. Huang, L. Li, B. Yang, M.-Z. Li, D.-X. Yan, J. Lei, Z.-M. Li, Carbon N. Y. 152, 316 (2019)
H. Mei, X. Zhao, J. Xia, F. Wei, D. Han, S. Xiao, L. Cheng, Mater. Des. 144, 323 (2018)
C. Xing, S. Zhu, Z. Ullah, X. Pan, F. Wu, X. Zuo, J. Liu, M. Chen, W. Li, Q. Li, L. Liu, Appl. Surf. Sci. 491, 616 (2019)
S. Sankaran, K. Deshmukh, M.B. Ahamed, S.K. Khadheer Pasha, Compos. A 114, 49 (2018)
J.H. Hubbell, S.M. Seltzer. http://physics.nist.gov/PhysRefData/XrayMassCoef/cover.html. Accessed 29 Oct 2021
M. Nauer, K. Ernst, W. Kautek, M. Neumann-Spallart, Thin Solid Films 489, 86 (2005)
Y.I. Kim, K.B. Kim, M. Kim, J. Mater. Sci. Technol. 51, 193 (2020)
C.Y. Lee, H.G. Song, K.S. Jang, E.J. Oh, A.J. Epstein, J. Joo, Synth. Met. 102, 1346 (1999)
Acknowledgements
This study was supported by the GRRC (Gyeonggi Regional Research Center) program of Gyeonggi province (GRRC Sungkyunkwan 2017-B02).
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J-HP: Conceptualization, data curation, formal analysis, investigation, writing, review, and editing. JCR: Formal analysis. S-JS: Resources, supervision, writing—Review and Editing.
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Park, JH., Ro, J.C. & Suh, S.J. Optimization of the NiFe/Cu multilayer structure using magnetron sputtering for electromagnetic interference shielding in high-frequency bands. J Mater Sci: Mater Electron 33, 4064–4071 (2022). https://doi.org/10.1007/s10854-021-07599-3
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DOI: https://doi.org/10.1007/s10854-021-07599-3