Abstract
Due to the miniaturization development in the electronic packaging industry and the significant thermal management requirement for high-power electronic devices, the sintered Ag has become one of the promising die-attach materials. Nevertheless, the mechanical reliability of the sintered Ag is still undergoing intensive examinations and investigations by both academy and industry. In this paper, the research progress is reviewed by focusing on the tensile, creep, and fatigue properties of sintered Ag in recent years to facilitate finite element (FE) simulations of mechanical reliability. The purpose is to obtain the mechanical reliability of the sintered Ag at a low cost by combining FE simulation. Firstly, to understand the constitutive behavior and quantify the mechanical properties as the basis of FE analysis, the stress–strain curves of the sintered Ag are adopted from tensile tests subjected to varying strain rates and temperatures. As the high temperature is the most influential factor in the service condition of die-attach materials, the relationship between constitutive parameters and temperatures is summarized. To quantify the creep behavior of packaging structures in the long-term service state, the constitutive models for creep under shear strain are addressed and the steady-state creep strain rate is emphasized. The influence of temperature and applied shear stress on creep strain rate is revealed. Regarding the effect of sintering condition on creep deformation, it is further explained that a higher applied pressure during the sintering process improves the initial shear strength of Ag lap joints and thus enhance the creep resistance against shear deformation. Finally, the fatigue behavior with damage accumulation under cyclic shear loading is reviewed by focusing on the evolutions of ratcheting response and hysteresis loop. To complement the FE predictions of mechanical reliability, the empirical damage models and fatigue life models are discussed to achieve a concise understanding of the mechanical reliability of sintered Ag under coupled thermo-mechanical loading.
Similar content being viewed by others
References
S.F. Choudhury, L. Ladani, Experimental observation of the effect of crystallographic orientation on mechanical behavior of single crystal Cu6Sn5 intermetallic. Asme Int. Tech. Conf. Exhibit. Packag. Integrat. Electron. Photo. Microsyst. (2013). https://doi.org/10.1115/IPACK2013-73315
M.N. Islam, A. Sharif, Y.C. Chan, Effect of volume in interfacial reaction between eutectic Sn–3.5% Ag–0.5% Cu solder and Cu metallization in microelectronic packaging. J. Electron. Mater. 34(2), 143–149 (2005)
L. Yi, C.P. Wong, Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Mater. Sci. Eng. R Rep. 51(1–3), 1–35 (2006)
T. Licht, R. Speckels, M. Thoben, Sintering technology used for interconnection of large areas: potential and limitation for power modules, International Conference on Integrated Power Electronics Sytems, (2010)
H. Wang, X. Hu, X. Jiang, Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn–3.0Ag–0.5Cu composite solder joints. Mater. Charact. 163, 110287 (2020)
S. Bontemps, L. Azzopardi, F. Henaff, T. Youssef, J. Joguet, Lifetime evaluation of nanoscale silver sintered power modules for automotive application based on experiments and finite-element modeling. IEEE Trans. Dev. Mater. Reliab. 15(3), 326–334 (2015)
J. Villain, O.S. Brueller, T. Qasim, Creep behaviour of lead free and lead containing solder materials at high homologous temperatures with regard to small solder volumes. Sens. Actuators. A Phys. 99(1–2), 194–197 (2002)
A. Torbati-Sarraf, R. Mahmudi, A.R. Geranmayeh, A. Baradaran-Goorani, Creep of lead-free Sn–3.8Ag and Sn–3.8Ag–0.7Cu solder alloy as replacements of Sn-Pb solder used in microelectronic packaging, Electronic Manufacturing Technology Symposium (IEMT), 33rd IEEE/CPMT International, (2008)
J.H. Lau, S.H. Pan, Creep behaviors of flip chip on board with 96.5Sn–3.5Ag and 100In lead-free solder joints. Int. J. Microcirc. Electron. Packag. 24(1), 11–18 (2000)
W.D. MacDonald, T.W. Eagar, Transient liquid phase bonding. Annu. Rev. Mater. Sci. 22, 23–46 (1992)
K.S. Siow, Y.T. Lin, Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study. J. Electron. Packag. 138(3), 020804 (2016)
I. Tuah-Poku, M. Dollar, T.B. Massalski, A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint. Metall. Trans. A 19(3), 675–686 (1988)
W.B. Tang, X. Long, F.Q. Yang, Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: effect of annealing temperature—sciencedirect. Microelectron. Reliab. 104, 113555 (2020)
L. Zhang, C.W. He, Y.H. Guo, Development of SnAg-based lead free solders in electronics packaging. Microelectron. Reliab. 52(3), 559–578 (2012)
H.Z. Wang, X.W. Hu, X.X. Jiang, Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag–0.5Cu composite solder joints. Mater. Charact. 163, 110287 (2020)
H.Z. Wang, X.W. Hu, X.X. Jiang, Y.L. Li, Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux. J. Manuf. Process 62(12), 291–301 (2021)
X.W. Hu, H. Xu, W.J. Chen, X.X. Jiang, Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints. J. Manuf. Process 64, 648–654 (2021)
C. Buttay, D. Planson, B. Allard, D. Bergogne, P. Bevilacqua, C. Joubert, M. Lazar, C. Martin, H. Morel, D. Tournier, C. Raynaud, State of the art of high temperature power electronics. Mater. Sci. Eng. B 176(4), 283–288 (2011)
V.R. Manikam, K.Y. Cheong, Die attach materials for high temperature applications: a review. IEEE Trans. Compon. Packag. Manuf. Technol. 1(4), 457–478 (2011)
T.F. Chen, K.S. Siow, Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints. J. Alloy. Compd. 866, 158783 (2021)
K.S. Siow, Are sintered silver joints ready for use as interconnect material in microelectronic packaging? J. Electron. Mater. 43(4), 947–961 (2014)
G.Q. Lu, J.N. Calata, Z. Zhang, J.G. Bai, A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging, IEEE Cpmt Conference on High Density Microsystem Design & Packaging & Component Failure Analysis, (2004)
K.S. Siow, Mechanical properties of nano-silver joints as die attach materials. J. Alloy. Compd. 514(2), 6–19 (2011)
Y.T. Su, G.C. Fu, C.Q. Liu, C.Y. Liu, X. Long, Fatigue crack evolution and effect analysis of Ag sintering die-attachment in SiC power devices under power cycling based on phase-field simulation. Microelectron. Reliab. (2021). https://doi.org/10.1016/j.microrel.2021.114244
J. Heilmann, I. Nikitin, U. Zschenderlein, D. May, K. Pressel, B. Wunderle, Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests. Microelectron. Reliab. 74, 136–146 (2017)
X. Long, B. Hu, Y.H. Feng, C. Chang, M.Y. Li, Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation - sciencedirect. Int. J. Mech. Sci. 161–162, 105020 (2019)
C.T. Chen, C.Y. Choe, D.J. Kim, Z. Zhang, X. Long, F.S. Wu, K. Suganuma, Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro. J. Alloy. Compd. 834, 155173 (2020)
C.T. Chen, S. Nagao, K. Suganuma, J.T. Jiu, T. Sugahara, H. Zhang, T. Iwashige, K. Sugiura, K. Tsuruta, Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices. Acta Mater. 129, 41–51 (2017)
A.H. Almasri, G.Z. Voyiadjis, Nano-indentation in FCC metals: experimental study. Acta Mech. 209(1), 1–9 (2010)
R.W. Hertzberg, R.P. Vinci, J.L. Hertzberg, Deformation and fracture mechanics of engineering materials. General & introductory materials science, 5th edn. (Wiiley, Hoboken, 2012), p. 784
P.A. Thornton, V.J. Colangelo, Variation of mechanical properties in large steel forgings. Metall. Trans. B 7(3), 425 (1976)
G. Chen, Z.S. Zhang, Y.H. Mei, X. Li, D.J. Yu, L. Wang, X. Chen, Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint. Mech. Mater. 72, 61–71 (2014)
K.L. Anand, An internal variable constitutive model for hot working of metals. Int. J. Plast. 5(2), 95–130 (1989)
X. Long, X. He, Y. Yao, An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates. J. Mater. Sci. 52(10), 6120–6137 (2017)
Y.T. Su, G.C. Fu, C.Q. Liu, K. Zhang, L.G. Zhao, C.Y. Liu, A.L. Liu, J.N. Song, Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores. Comput. Methods Appl. Mechan. Eng. 378, 113729 (2021)
P. Gadaud, V. Caccuri, D. Bertheau, J. Carr, X. Milhet, Ageing sintered silver: Relationship between tensile behavior, mechanical properties and the nanoporous structure evolution. Mater. Sci. Eng. A 669, 379–386 (2016)
E. Ide, S. Angata, A. Hirose, K.F. Kobayashi, Metal–metal bonding process using Ag metallo-organic nanoparticles. Acta Mater. 53(8), 2385–2393 (2005)
J.F. Li, C.M. Johnson, C. Buttay, W. Sabbah, S. Azzopardi, Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. J. Mater. Process. Technol. 215(1), 299–308 (2015)
D.J. Yu, C. Xu, C. Gang, G.Q. Lu, Z.Q. Wang, Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment. Mater. Des. 30(10), 4574–4579 (2009)
W. Tao, C. Gang, Y. Wang, C. Xu, G.Q. Lu, Uniaxial ratcheting and fatigue behaviors of low-temperature sintered nano-scale silver paste at room and high temperatures. Mater. Sci. Eng. A 527(24–25), 6714–6722 (2010)
C. Chen, C. Choe, D. Kim, K. Suganuma, Lifetime prediction of a SiC power module by micron/submicron Ag sinter joining based on fatigue, creep and thermal properties from room temperature to high temperature. J. Electron. Mater. 50, 687–698 (2020)
K.S. Siow, A.A.O. Tay, P. Oruganti, Mechanical properties of nanocrystalline copper and nickel. Mater. Sci. Technol. 20(3), 285–294 (2004)
S.R. Agnew, B.R. Elliott, C.J. Youngdahl, K.J. Hemker, J.R. Weertman, Microstructure and mechanical behavior of nanocrystalline metals. Mater. Sci. Eng. A 285(1–2), 391–396 (2000)
P.G. Sanders, J.A. Eastman, J.R. Weertman, Elastic and tensile behavior of nanocrystalline copper and palladium. Acta Mater. 45(10), 4019–4025 (1997)
A. Bachmaier, A. Hohenwarter, R. Pippan, New procedure to generate stable nanocrystallites by severe plastic deformation. Scripta Mater. 61(11), 1016–1019 (2009)
T. Herboth, M. Guenther, A. Fix, J. Wilde, Failure mechanisms of sintered silver interconnections for power electronic applications, in 2013 IEEE 63rd Electronic Components and Technology Conference (2013)
I. Nikitin, K. Pressel, Mechanical properties of porous silver materials depending on sintering parameters, in 20th International Workshop on Thermal Investigations of ICs and Systems (2014)
J.G. Bai, Z.Z. Zhang, J.N. Calata, G.Q. Lu, Characterization of low-temperature sintered nanoscale silver paste for attaching semiconductor devices, in High Density Microsystem Design and Packaging and Component Failure Analysis (2005)
T.G. Lei, J. Calata, S.F. Luo, G.Q. Lu, X. Chen, Low-temperature sintering of nanoscale silver paste for large-area joints in power electronics modules. Key Eng. Mater. 353–358(4), 2948–2953 (2007)
J.G. Bai, Z.Z. Zhang, J.N. Calata, G.Q. Lu, Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material. IEEE Trans. Compon. Packag. Technol. 29(3), 589–593 (2006)
C. Xu, L. Rong, K. Qi, G.Q. Lu, Tensile behaviors and ratcheting effects of partially sintered chip-attachment films of a nanoscale silver paste. J. Electron. Mater. 37(10), 1574–1579 (2008)
G. Chen, X. Zhao, Constitutive modelling on the whole-life uniaxial ratcheting behavior of sintered nano-scale silver paste at room and high temperatures. Microelectron. Reliab. 80, 47–54 (2018)
X. Long, W. Tang, J. Liu, X. Lu, C. Zhou, W. Xia, Y. Wu, Estimating the constitutive behaviour of sintered silver nanoparticles by nanoindentation, International Conference on Electronic Packaging Technology, (2018), pp. 466-471
X. Long, C. Du, Z. Li, H. Guo, Y. Yao, X. Lu, X. Hu, L. Ye, J. Liu, Finite element analysis to the constitutive behavior of sintered silver nanoparticles under nanoindentation. Int. J. Appl. Mech. (2019). https://doi.org/10.1142/S1758825118501107
S.A. Paknejad, S.H. Mannan, Review of silver nanoparticle based die attach materials for high power/temperature applications. Microelectron. Reliab. 70, 1–11 (2017)
Z. Zhang, C.T. Chen, A. Suetake, M.C. Hsieh, A. Iwaki, K. Suganuma, Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste. Scripta Materialia 198, 113833 (2021)
S. Sakamoto, K. Suganuma, Thermo mechanical reliability of low-temperature low-pressure die bonding using thin Ag flake pastes, in 7th International Conference on Integrated Power Electronics Systems (2012)
Y.H. Mei, Z. Wang, K.S. Siow, Reliability and failure mechanisms of sintered silver as die attach joint: materials, processes, equipment, and reliability, in Die-Attach Materials for High Temperature Applications in Microelectronics Packaging (2019), pp. 125–150
H.G. Zheng, D. Berry, J.N. Calata, K.D.T. Ngo, S.S. Luo, G.Q. Lu, Low-pressure joining of large-area devices on copper using nanosilver paste. IEEE Trans. Compon. Packag. Manuf. Technol. 3(6), 915–922 (2013)
T.G. Lei, J.N. Calata, G.Q. Lu, X. Chen, S. Luo, Low-temperature sintering of nanoscale silver paste for attaching large-area (ï¼ 100mm2) chips. IEEE Trans. Compon. Packag. Technol. 33(1), 98–104 (2010)
L.A. Navarro, X. Perpiñà, M. Vellvehi, X. Jordà, Silver nano-particles sintering process for the die-attach of power devices for high temperature applications. Ingeniería Mecánica Tecnología Y Desarrollo 4(3), 97–102 (2012)
R. Khazaka, L. Mendizabal, D. Henry, Review on joint shear strength of nano-silver paste and its long-term high temperature reliability. J. Electron. Mater. 43(7), 2459–2466 (2014)
G.S. Zou, J.F. Yan, F.W. Mu, A.P. Wu, J.L. Ren, A.M. Hu, Low temperature bonding of Cu metal through sintering of Ag nanoparticles for high temperature electronic application. Open Surf. Sci. J. 3(1), 70–75 (2011)
T. Wang, X. Chen, G.Q. Lu, G.Y. Lei, Low-temperature sintering with nano-silver paste in die-attached interconnection. J. Electron. Mater. 36(10), 1333–1340 (2007)
M.Y. Wang, Y.H. Mei, X. Li, G.Q. Lu, Relationship between transient thermal impedance and shear strength of pressureless sintered silver as die attachment for power devices, in International Conference on Electronics Packaging and iMAPS All Asia Conference (2015), pp. 559–564
S.A. Paknejad, A. Mansourian, J. Greenberg, K. Khtatba, S.H. Mannan, Microstructural evolution of sintered silver at elevated temperatures. Microelectron. Reliab. 63, 125–133 (2016)
H. Ma, J.C. Suhling, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. 44(5), 1141–1158 (2009)
X. Li, G. Chen, L. Wang, Y.H. Mei, X. Chen, G.Q. Lu, Creep properties of low-temperature sintered nano-silver lap shear joints. Mater. Sci. Eng. A 579(1), 108–113 (2013)
Y.C. Lin, Y.C. Xia, X.S. Ma, Y.Q. Jiang, M.S. Chen, High-temperature creep behavior of Al–Cu–Mg alloy. Mater. Sci. Eng. A 550(30), 125–130 (2012)
Y.C. Lin, Y.C. Xia, Y.Q. Jiang, L.T. Li, Precipitation in Al–Cu–Mg alloy during creep exposure. Mater. Sci. Eng. A 556(30), 796–800 (2012)
Y.C. Lin, Y.C. Xia, M.S. Chen, Y.Q. Jiang, L.T. Li, Modeling the creep behavior of 2024-T3 Al alloy. Comput. Mater. Sci. 67, 243–248 (2013)
F. Garofalo, D.B. Butrymowicz, Fundamentals of creep and creep-rupture in metals. Phys. Today 19(5), 100–102 (1966)
Y.H. Pao, S. Badgley, E. Jih, R. Govila, J. Browning, Constitutive behavior and low cycle thermal fatigue of 97Sn3Cu solder joints. J. Electron. Packag. 115(2), 147–152 (1993)
J.E. Dorn, Some fundamental experiments on high temperature creep. J. Mech. Phys. Solids 3(2), 85–116 (1955)
Z.G. Chen, Y.W. Shi, Z.D. Xia, Constitutive relations on creep for SnAgCuRE lead-free solder joints. J. Electron. Mater. 33(9), 964–971 (2004)
R.W. Evans, B. Wilshire, Creep of Metals and Alloys (The Institute of Metals, UK, 1985)
G. Chen, X.H. Sun, P. Nie, Y.H. Mei, G.Q. Lu, C. Xu, High-temperature creep behavior of low-temperature-sintered nano-silver paste films. J. Electron. Mater. 41(4), 782–790 (2012)
X. Li, G. Chen, X. Chen, G.Q. Lu, L. Wang, Y.H. Mei, High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. Microelectron. Reliab. 53(1), 174–181 (2013)
Y.S. Tan, X. Li, X. Chen, Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature. Microelectron. Reliab. 54(3), 648–653 (2014)
G.Z. Kang, Q.H. Kan, J. Zhang, Y.F. Sun, Time-dependent ratchetting experiments of SS304 stainless steel. Int. J. Plast. 22(5), 858–894 (2006)
L. Yu, X. Chen, Y.Z. Wang, X. Li, Y.H. Mei, Influence of temperature and microstructure on the mechanical properties of sintered nanosilver joints. Mater. Sci. Eng. A 626, 390–399 (2015)
C. Weber, M. Hutter, S. Schmitz, K.D. Lang, Dependency of the porosity and the layer thickness on the reliability of Ag sintered joints during active power cycling, Electronic Components & Technology Conference, 2015
L. Zhang, B. Zhao, B.K. Guo, Fatigue damage accumulation rule of notched specimen. Harbin Gongye Daxue Xuebao/J. Harbin Inst. Technol. 40(11), 1703–1706 (2008)
G. Chen, X. Zhao, Constitutive modelling on the whole-life uniaxial ratcheting behavior of sintered nano-scale silver paste at room and high temperatures. Microelectron. Reliab. 80, 47–54 (2018)
D. Krajcinovic, G.U. Fonseka, The continuous damage theory of brittle materials, part 1: general theory. J. Appl. Mech. 48(4), 809–815 (1981)
J.L. Chaboche, P.M. Lesne, A non-linear continuous fatigue damage model. Fatigue Fracture Eng. Mater. Struct. 11(1), 1–17 (2010)
M. Kobayashi, N. Ohno, T. Igari, Ratchetting characteristics of 316FR steel at high temperature, part II: analysis of thermal ratchetting induced by spatial variation of temperature. Int. J. Plast. 14(4–5), 373–390 (1998)
D.H. Yu, G. Chen, W.W. Yu, D.M. Li, X. Chen, Visco-plastic constitutive modeling on Ohno–Wang kinematic hardening rule for uniaxial ratcheting behavior of Z2CND18.12 N steel. Int. J. Plast. 28(1), 88–101 (2012)
Acknowledgements
This work was supported by the Natural Science Foundation of Shaanxi Province (Grant Nos. 2021KW-25), the Astronautics Supporting Technology Foundation of China (Grant No. 2019-HT-XG), and the Fundamental Research Funds for the Central Universities (Grant No. 3102018ZY015).
Author information
Authors and Affiliations
Contributions
XL: Conceptualization, supervision; writing—original draft; YG: writing—original draft, Investigation; YS: investigation; KSS: writing—review & editing, CC: Writing—review & editing.
Corresponding author
Ethics declarations
Conflict of interest
The authors declare that they have no known competing financial interest or personal relationships that could have appeared to influence the work reported in this paper.
Consent for publication
The authors declare that this manuscript has not been published previously and is not under consideration for publication elsewhere.
Additional information
Publisher’s Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Long, X., Guo, Y., Su, Y. et al. Constitutive, creep, and fatigue behavior of sintered Ag for finite element simulation of mechanical reliability: a critical review. J Mater Sci: Mater Electron 33, 2293–2309 (2022). https://doi.org/10.1007/s10854-021-07474-1
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-021-07474-1