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Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere

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Abstract

In this study, a two-step process involving oxygen plasma surface activation and thermos-compression in Pt-catalyzed formic acid gas was used to bond Cu foil and polyimide. The oxygen plasma was used to activate the polyimide surface to achieve strong adhesion with sputtered deposition film, and the Pt-catalyzed formic acid gas removed the oxides on the Cu surface effectively to promote bonding between Cu foil and polyimide. Via this method, a void-less bonding with a maximum shear strength of 20.31 MPa was achieved. The plasma bombardment was found to promote the formation of C-O-Cr and N-Cr bonds between polyimide and deposition metals, which improved their adhesion. After shear test, striped metal films remained on fracture surfaces at both polyimide and Cu foil sides, suggesting the fracture mainly occurred within adhered deposition metals rather than at bonding interface. This low-temperature bonding method is promising to achieve the direct integration between polyimide and copper foil without adhesive, which plays a key role in flexible device integration.

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Acknowledgements

This work was supported in part by National Natural Science Foundation of China under Grant Nos. 62004213, 61527816, 11634002, 61631021, 62074161, 61822407, and U20A20208; in part by the Key Research Program of Frontier Sciences, Chinese Academy of Sciences (CAS) under Grant No. QYZDB-SSW-JSC012; in part by the Youth Innovation Promotion Association of CAS; in part by the University of CAS; and in part by the Opening Project of Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, CAS.

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Authors and Affiliations

  1. High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China

    Ying Meng, Yang Xu, Runhua Gao, Xinhua Wang, Xiaojuan Chen, Sen Huang, Ke Wei, Dahai Wang, Haibo Yin, Fengwen Mu & Xinyu Liu

  2. University of Chinese Academy of Sciences, Beijing, 100049, China

    Ying Meng, Xinhua Wang, Sen Huang & Xinyu Liu

  3. Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China

    Xinhua Wang & Sen Huang

  4. Collaborative Research Center, Meisei University, Hino-shi, Tokyo, 191-8506, Japan

    Kai Takeuchi & Tadatomo Suga

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  1. Ying Meng
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  2. Yang Xu
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Correspondence to Runhua Gao or Fengwen Mu.

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Meng, Y., Xu, Y., Gao, R. et al. Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere. J Mater Sci: Mater Electron 33, 2582–2589 (2022). https://doi.org/10.1007/s10854-021-07463-4

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  • DOI: https://doi.org/10.1007/s10854-021-07463-4

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