Skip to main content
Log in

The effect of alkaline earth additions on the physical property and the corrosion behavior of Sn-0.7Cu-0.075Al solder alloy

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

In this study, Sn-0.7Cu-0.075Al alloy (SCA alloy for short) was prepared by ball milling and vacuum melting. The effects of adding Sr and Ca on the microstructure, mechanical properties, physical properties, and electrochemical corrosion properties of SCA alloy were studied. The results show that the content of Cu6Sn5/β-Sn eutectic phase in the microstructure of SCA alloy decreases with the addition of Sr and Ca, and oxide impurity appears in the microstructure of the alloy. The addition of Sr and Ca decreased the electrical conductivity, microhardness, and tensile strength of SCA alloy. The wettability of SCA alloy increases first and then decreases with the addition of Sr and Ca. The addition of Sr and Ca resulted in the formation of a dense corrosion product film with good adhesion during the corrosion process of SCA alloy, which reduced the passivation current density (IP) of the alloy and effectively improved the passivation performance of SCA alloy.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17

Similar content being viewed by others

References

  1. K. Suganuma, Advances in lead-free electronics soldering. Curr. Opin. Solid. State. Mater. Sci. 5(1), 55–64 (2001)

    Article  CAS  Google Scholar 

  2. H.R. Kotadia, P.D. Howes, S.H. Mannan, A review: On the development of low melting temperature Pb-free solders. Microelectron. Reliab. 54(6–7), 1253–1273 (2014)

    Article  CAS  Google Scholar 

  3. Q.B. Tao, L. Benabou, V.N. Le, H. Hwang, D.B. Luu, Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni. J. Alloy. Compd. 694, 892–904 (2017)

    Article  CAS  Google Scholar 

  4. F.J. Wang, H. Chen, Y. Huang, L.T. Liu, Z.J. Zhang, Recent progress on the development of Sn-Bi based low-temperature Pb-free solders. J. Mater. Sci. Mater. Electron. 30(4), 3222–3243 (2019)

    Article  CAS  Google Scholar 

  5. S.R. Lim, J.M. Schoenung, Human health and ecological toxicity potentials due to heavy metal content in waste electronic devices with flat panel displays. J. Hazard. Mater. 177(1–3), 251–259 (2010)

    Article  CAS  Google Scholar 

  6. C.J. Li, Y.F. Yan, T.T. Gao, G.D. Xu, The influence of Ag on the microstructure, thermal properties and mechanical behavior of Sn-25Sb-xAg high temperature lead-free solder. Vacuum. 185, 110015 (2021)

    Article  CAS  Google Scholar 

  7. C.J. Li, Y.F. Yan, T.T. Gao, G.D. Xu, The microstructure, thermal, and mechanical properties of Sn-3.0Ag-0.5Cu-xSb high-temperature lead-free solder. Materials. 13(19), 4443 (2020)

    Article  CAS  Google Scholar 

  8. S. Li, X.X. Wang, Z.Y. Liu, F. Mao, Y.T. Jiu, J.Y. Luo, L.J. Shangguan, X.J. Jin, G. Wu, S.Y. Zhang, P. He, W. Long, Long, research status of evolution of microstructure and properties of sn-based lead-free composite solder alloys. J. Nanomater. (2020). https://doi.org/10.1155/2020/8843166

    Article  Google Scholar 

  9. Y. Zhang, C.J. Lu, Y.S. Liu, P.G. Zhang, Z.M. Sun, The effect of Bi addition on the formation of metal whiskers in Ti2SnC/Sn-xBi system. Vacuum. (2020). https://doi.org/10.1016/j.vacuum.2020.109764

    Article  Google Scholar 

  10. M.Y. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54(2), 1741–1768 (2019)

    Article  CAS  Google Scholar 

  11. B.L. Chen, G.Y. Li, An investigation of effects of Sb on the intermetallic formation in Sn-3.5Ag-0.7Cu solder joints. IEEE. Trans. Comp. Packag. Technol. 28(3), 534–541 (2005)

    Article  CAS  Google Scholar 

  12. S. Wiese, E. Meusel, K.J. Wolter, Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders. Elec. Comp. C. (2003). https://doi.org/10.1109/ECTC.2003.1216277

    Article  Google Scholar 

  13. S. Li, X.X. Wang, Z.Y. Liu, Y.T. Jiu, S.Y. Zhang, J.F. Geng, X.M. Chen, S.J. Wu, P. He, W.M. Long, Corrosion behavior of Sn-based lead-free solder alloys: a review. J. Mater. Sci. Mater. Electron. 31(12), 9076–9090 (2020)

    Article  CAS  Google Scholar 

  14. L. Yang, Y. Zhang, J. Dai, Y. Jing, J. Ge, N. Zhang, Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy. Mater. Design. 67, 209–216 (2015)

    Article  CAS  Google Scholar 

  15. Z.M. Lai, D. Ye, Effect of Al on the microstructure and properties of Sn-0.7Cu solder alloy. J. Mater. Sci. Mater. Electron. 27(2), 1177–1183 (2016)

    Article  CAS  Google Scholar 

  16. D.L. Han, Y.A. Shen, S.L. He, H. Nishikawa, Effect of Cu addition on the microstructure and mechanical properties of In-Sn-based low-temperature alloy. Mat. Sci. Eng. A. (2021). https://doi.org/10.1016/j.msea.2021.140785

    Article  Google Scholar 

  17. , A. Kantarcioglu, Y.E. Kalay, , Effects of Al and Fe additions on microstructure and mechanical properties of SnAgCu eutectic lead-free solders. Mater. Sci. Eng.A. 593, 79–84 (2014)

    Article  Google Scholar 

  18. D.A.A. Shnawah, S.B.M. Said, M.F.M. Sabri, I.A. Badruddin, T.G. Hoe, F.X. Che, A.N. Abood, Microstructure and tensile properties of Sn-1Ag-0.5Cu solder alloy bearing Al for electronics applications. J Electron. Mater. 41(8), 2073–2082 (2012)

    Article  Google Scholar 

  19. H.X. Xie, N. Chawla, Enhancing the ductility of Sn-Ag-Cu lead-free solder joints by addition of compliant intermetallics. J. Electron. Mater. 42(3), 527–536 (2013)

    Article  CAS  Google Scholar 

  20. Y.C. Lee, A.K. Dahle, D.H. StJohn, The role of solute in grain refinement of magnesium. Metall. Mater. Trans. A. 31(11), 2895–2906 (2000)

    Article  Google Scholar 

  21. J. Koo, J. Chang, Y.W. Lee, S.J. Hong, K.S. Kim, H.M. Lee, New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd Cr and Ca. J. Alloy. Compd. 608, 126–132 (2014)

    Article  CAS  Google Scholar 

  22. A.L. Goodwin, S.A.T. Redfern, M.T. Dove, D.A. Keen, M.G. Tucker, Ferroelectric nanoscale domains and the 905 K phase transition in SrSnO3: A neutron total-scattering study. Phys. Rev. B. (2007). https://doi.org/10.1103/PhysRevB.76.174114

    Article  Google Scholar 

  23. Q.Z. Liu, H.F. Wang, F. Chen, W.B. Wu, Single-crystalline transparent and conductive oxide films with the perovskite structure: Sb-doped SrSnO3. J. Appl. Phys. (2008). https://doi.org/10.1063/1.2917413

    Article  Google Scholar 

  24. Y. Gao, C. Cheng, J. Zhao, L. Wang, X. Li, Electrochemical corrosion of Sn–0.75Cu solder joints in NaCl solution. Trans. Nonferrous. Met. Soc. China. 22(4), 977–982 (2012)

    Article  CAS  Google Scholar 

  25. H.S. Mohran, A.R. El-Sayed, H.M.A. El-Lateef, Anodic behavior of tin, indium, and tin-indium alloys in oxalic acid solution. J. Solid. State. Electron. 13(8), 1279–1290 (2009)

    Article  CAS  Google Scholar 

  26. A. Sharma, M.C. Oh, J.T. Kim, A.K. Srivastava, B. Ahn, Investigation of electrochemical corrosion behavior of additive manufactured Ti-6Al-4V alloy for medical implants in different electrolytes. J. Alloy. Compd. (2020). https://doi.org/10.1016/j.jallcom.2020.154620

    Article  Google Scholar 

  27. P.E. Alvarez, S.B. Ribotta, M.E. Folquer, C.A. Gervasi, J.R. Vilche, Potentiodynamic behaviour of tin in different buffer solutions. Corros. Sci. 44(1), 49–65 (2002)

    Article  CAS  Google Scholar 

  28. H.A. Jaffery, M.F.M. Sabri, S.M. Said, S.W. Hasan, I.H. Sajid, N.I.M. Nordin, M.M.I. Megat Hasnan, D.A. Shnawah, C.V. Moorthy, Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron. J Alloy Compd (2019). https://doi.org/10.1016/j.jallcom.2019.151925

    Article  Google Scholar 

  29. W.R. Osorio, E.S. Freitas, J.E. Spinelli, A. Garcia, Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution. Corros. Sci. 80, 71–81 (2014)

    Article  CAS  Google Scholar 

  30. Y.F. Gao, C.Q. Cheng, J. Zhao, L.H. Wang, X.G. Li, Electrochemical corrosion of Sn-07.5Cu solder joints in NaCl solution. Trans. Nonferrous. Met. Soc. China. 22(4), 977–982 (2012)

    Article  CAS  Google Scholar 

  31. M. Fayeka, M.A. Fazal, A.S.M.A. Haseeb, Effect of aluminum addition on the electrochemical corrosion behavior of Sn-3Ag-0.5Cu solder alloy in 3.5 wt% NaCl solution. J. Mater. Sci. Mater Electron. 27(11), 12193–12200 (2016)

    Article  CAS  Google Scholar 

  32. C.M.L. Wu, M.L. Huang, Creep behavior of eutectic Sn-Cu lead-free solder alloy. J. Electron. Mater. 31(5), 442–448 (2002)

    Article  CAS  Google Scholar 

Download references

Acknowledgements

This research work is supported by the Guangxi Natural Science Foundation (2020GXNSFBA297062, 2018GXNSFDA050008, 2020GXNSFAA159093), the National Natural Science Foundation of China (51761002) and the Training Plan of High-Level Talents of Guangxi University (XMPZ160714).

Author information

Authors and Affiliations

Authors

Corresponding authors

Correspondence to Wenchao Yang or Yongzhong Zhan.

Ethics declarations

Conflict of interest

We declare that we have no financial and personal relationships with other people or organizations that can inappropriately influence our work, there is no professional or other personal interest of any nature or kind in any product, service and/or company that could be construed as influencing the position presented in, or the review of, the manuscript entitled.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Qi, D., Du, Z., Fu, Y. et al. The effect of alkaline earth additions on the physical property and the corrosion behavior of Sn-0.7Cu-0.075Al solder alloy. J Mater Sci: Mater Electron 32, 24152–24167 (2021). https://doi.org/10.1007/s10854-021-06881-8

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-021-06881-8

Navigation