Abstract
It is of great interest and remains a challenge to simultaneously improve the low dielectric properties and chemical resistances of addition-cure liquid silicone rubber (ALSR). In this work, we proposed an efficient approach to address this issue by filling silicone-modified Eucommia ulmoides gum nanofiller (SEUG) into ALSR. By adding 5 wt% SEUG, the dielectric constant of the SEUG/ALSR composite rubber was significantly lower than that of neat ALSR both at 102 Hz, 103 Hz, and 104 Hz. Simultaneously, the SEUG/ALSR composite rubber exhibited better mechanical and insulation properties than the neat ALSR after HCl, NaCl, and oil resistance tests. Our findings demonstrated the great potential for fabricating silicone rubber with low dielectric properties and erosion resistance by the utilization of natural biomass rubber material, endowing it with excellent mechanical performance and degradability.
Similar content being viewed by others
References
V. Kumaresan, S. Sreekantan, M. Devarajan, K. Mohamed, J. Mater. Sci.: Mater. Electron. (2021). https://doi.org/10.1007/s10854-020-04864-9
W. Fang, X. Zeng, X. Lai, H. Li, W. Chen, Thermochim. Acta (2015). https://doi.org/10.1016/j.tca.2015.02.011
C. Xie, X. Lai, H. Li, X. Zeng, Polym. Degrad. Stab. (2019). https://doi.org/10.1016/j.polymdegradstab.2019.06.014
Y. Liu, C. Ma, Y. Li, Z. Yin, J. Su, J. Gao, Plast. Rubber Compos. (2018). https://doi.org/10.1080/14658011.2018.1468586
H. Li, Y. Li, T. Wu, X. Liao, T. Liu, X. Lai, X. Zeng, Surf. Interfaces (2019). https://doi.org/10.1016/j.surfin.2018.11.009
L. Guo, X. Yang, F. Dong, Y. Qian, J. Guo, X. Lin et al., Mater. Chem. Phys. (2020). https://doi.org/10.1016/j.matchemphys.2020.122868
Y. Li, C. Zang, Y. Zhang, Mater. Chem. Phys. (2020). https://doi.org/10.1016/j.matchemphys.2020.122734
Y. Li, X. Zeng, X. Lai, H. Li, W. Fang, Polym. Test. (2017). https://doi.org/10.1016/j.polymertesting.2017.08.017
W. Fang, X. Lai, H. Li, W. Chen, X. Zeng, L. Zhang, S. Yang, Polym. Test. (2014). https://doi.org/10.1016/j.polymertesting.2014.04.007
Y. Zhang, X. Zeng, X. Lai, H. Li, X. Huang, Polym. Test. (2018). https://doi.org/10.1016/j.polymertesting.2018.05.005
J. Qiu, X. Lai, W. Fang, H. Li, X. Zeng, Polym. Degrad. Stab. (2017). https://doi.org/10.1016/j.polymdegradstab.2017.08.005
C. Xie, X. Zeng, W. Fang, X. Lai, H. Li, Polym. Degrad. Stab. (2017). https://doi.org/10.1016/j.polymdegradstab.2017.07.015
T. Liu, X. Zeng, W. Fang, X. Lai, H. Li, Appl. Surf. Sci. (2017). https://doi.org/10.1016/j.apsusc.2017.06.117
T. Wu, X. Lai, F. Liu, H. Li, X. Zeng, Appl. Surf. Sci. (2018). https://doi.org/10.1016/j.apsusc.2018.08.021
M. Sarkarat, M. Lanagan, D. Ghosh, A. Lottes, K. Budd, R. Rajagopalan, Mater. Today Commun. (2020). https://doi.org/10.1016/j.mtcomm.2020.100947
L. Yu, A. Skov, Int. J. Smart. Nano Mater. (2015). https://doi.org/10.1080/19475411.2015.1119216
D.T. Vaimakis-Tsogkas, D.G. Bekas, T. Giannakopoulou, N. Todorova et al., Mater. Chem. Phys. (2019). https://doi.org/10.1016/j.matchemphys.2018.11.011
I. Rezaeian, P. Zahedi, M.S. Loghmani, M. Shahzamani, Plast., Rubber Compos. (2009). https://doi.org/10.1179/174328909X435401
S. Azizi, G. Momen, C. Ouellet-Plamondon, E. David, Polym. Test. (2020). https://doi.org/10.1016/j.polymertesting.2019.106281
D. Liu, L. Song, H. Song, J. Chen, Q. Tian, L. Chen et al., Compos. Sci. Technol. (2018). https://doi.org/10.1016/j.compscitech.2018.07.024
D. Chen, Y. Liu, C. Huang, Polym. Degrad. Stab. (2012). https://doi.org/10.1016/j.polymdegradstab.2011.12.016
P. Indumathy, B. Kothandaraman, Plast. Rub. Compos. (2020). https://doi.org/10.1080/14658011.2020.1718325
I. Chiulan, D. Panaitescu, E. Radu, A.N. Frone et al., J. Mech. Behav. Biol. Mater. (2020). https://doi.org/10.1016/j.jmbbm.2019.103427
J. Bai, X. Liao, E. Huang, Y. Luo, Q. Yang, Mater. Des. (2017). https://doi.org/10.1016/j.matdes.2017.07.064
C. Chen, Y. He, C. Liu, H. Xie, W. Yu, J. Mater. Sci. Mater. Electron. (2020). https://doi.org/10.1007/s10854-020-03016-3
J. Feng, Z. Liu, D. Zhang, Z. He, Z. Tao, Q. Guo, New Car Mater. (2019). https://doi.org/10.1016/S1872-5805(19)60011-9
G. Wang, X. Liao, J. Yang, W. Tang, Y. Zhang, Q. Jiang, G. Li, Compos. Sci. Technol. (2019). https://doi.org/10.1016/j.compscitech.2019.107847
M. Chang, Y. Li, L. Xu, W. Wang, C. Wang, R. Wang, J. Mater. Sci.: Mater. Electron. (2018). https://doi.org/10.1007/s10854-017-8198-2
P. Song, J. Song, Y. Zhang, Compos. Part B: Eng. (2020). https://doi.org/10.1016/j.compositesb.2020.107979
P. Liu, L. Li, L. Wang, T. Huang, Y. Yao, W. Xu, J. Alloys Compos. (2019). https://doi.org/10.1016/j.jallcom.2018.10.002
Q. Chen, B. Xi, J. Zhang, H. Yang, X. Wang, M. Chi, J. Mater. Sci.: Mater. Electron. (2020). https://doi.org/10.1007/s10854-020-04213-w
L.K. Namitha, S. Ananthakumar, M.T. Sebastian, J. Mater. Sci.: Mater. Electron. (2014). https://doi.org/10.1007/s10854-014-2479-9
G. Boccalero, C. Jean-Mistral, M. Castellano, C. Boragno, Compos. Part B: Eng. (2018). https://doi.org/10.1016/j.compositesb.2018.03.021
C. Li, H. Fan, T. Aziz, C. Bittencourt, L. Wu, D. Wang, A.C.S. Susta, Chem. Eng. (2018). https://doi.org/10.1021/acssuschemeng.8b01212
Y. Cheng, C. Lee, W. Hung, G. Chen, J. Fang, Surf. Coat. Technol. (2018). https://doi.org/10.1016/j.surfcoat.2018.06.071
X. Wei, P. Peng, F. Peng, J. Dong, J. Agric. Food Chem. (2021). https://doi.org/10.1021/acs.jafc.0c07560
B. Chen, Q. Wu, J. Li, K. Lin, D. Chen, C. Zhou, T. Wu, X. Luo, Y. Liu, Chem. Eng. J. (2020). https://doi.org/10.1016/j.cej.2019.122323
B.U. Kang, J.Y. Kim, J. Kim, S.S. Lee, M. Park, S. Lim, C.R. Choe, J. Appl. Polym. Sci. 79, 38–48 (2001)
B.J. Rohde, K.M. Le, R. Krishnamoorti, M.L. Robertson, Macromolecules (2016). https://doi.org/10.1021/acs.macromol.6b01649
D. Yang, Y. Ni, X. Kong, D. Gao, Y. Wang, T.L. Hu, Compos. Sci. Technol. (2019). https://doi.org/10.1016/j.compscitech.2019.04.016
Y. Huang, X. Wei, L. Liu, H. Yu, J. Yang, Mater. Lett. (2018). https://doi.org/10.1016/j.matlet.2018.08.084
Acknowledgements
This research did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors. We thank LetPub (www. letpub. com) for its linguistic assistance during the preparation of this manuscript.
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Li, C., Su, S., Wang, B. et al. Effects of eucommia gum filler on the dielectric properties and chemical resistances of addition-cure liquid silicone rubber. J Mater Sci: Mater Electron 32, 20548–20558 (2021). https://doi.org/10.1007/s10854-021-06566-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-021-06566-2