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Effect of minor scandium addition on the microstructure and properties of Al–50Si alloys for electronic packaging

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Abstract

Al–50Si alloys for electronic packaging were prepared by gas atomization following hot press sintering, and the influences of adding minor Sc (0.3%) on microstructure and mechanical and thermo-physical properties were studied. The Si phase exhibits a semi-continuous network structure with an average size of 15–20 μm in the alloys with and without Sc addition. Transmission electron microscopy observation indicates that a fine spherical Sc-rich particle distributes at the interface between the Al matrix and Si phase in the Al–50Si-Sc alloy, which is further identified as AlSi2Sc2 (V-phase). The tensile strength, flexural strength, and hardness of the Al–50Si alloy are improved by 16.2%, 8.9%, and 14.7%, respectively, with the introduction of Sc. However, the coefficient of thermal expansion and thermal conductivity decreases slightly in the Al–50Si–Sc alloy as compared with the Al–50Si alloy. The increased strength is mainly attributed to the formation of fine spherical AlSi2Sc2 phase which strengthens the Al matrix.

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Acknowledgement

The authors are grateful for the financial support provided by the National Nature Science Foundation of China (51804349), the China Postdoctoral Science Foundation (2018M632986), the Nature Science Foundation of Hunan Province (2019JJ50766), and the Postdoctoral Science Foundation of Central South University and the Science and Technology Program of Hunan, China (2017GK2261).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Central South University, Changsha, 410083, China

    Shuaishuai Yu, Richu Wang, Chaoqun Peng, Zhiyong Cai, Xiang Wu, Yan Feng & Xiaofeng Wang

  2. National Key Laboratory of Science and Technology for National Defence on High-Strength Structural Materials, Central South University, Changsha, 410083, China

    Richu Wang, Zhiyong Cai & Yan Feng

  3. Key Laboratory of Electronic Packaging and Advanced Functional Materials, Changsha, 410083, Hunan, China

    Richu Wang

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  1. Shuaishuai Yu
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Correspondence to Zhiyong Cai.

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Yu, S., Wang, R., Peng, C. et al. Effect of minor scandium addition on the microstructure and properties of Al–50Si alloys for electronic packaging. J Mater Sci: Mater Electron 30, 20770–20777 (2019). https://doi.org/10.1007/s10854-019-02444-0

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  • DOI: https://doi.org/10.1007/s10854-019-02444-0

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