Skip to main content
Log in

Effect of polyvinyl chloride fire smoke on the long-term corrosion kinetics and surface microstructure of tin–lead and lead-free solders

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

With the rapid increase of electric power use, wire and cable fire occurs more and more frequently. While the fire smoke could corrode the solders on the printed circuit boards, which seriously affects the function of electronic equipment. In this research, the long-term corrosion behavior of Sn–37Pb, Sn–0.7Cu, and Sn–3.0Ag solders under 140 g m−3 polyvinyl chloride fire smoke atmosphere were investigated. The mass loss of all solders increased sharply on the first day and then varied exponentially in the subsequent time period. Particularly, the mass loss of Sn–37Pb solder gradually stabilized after 10 days, while that of lead-free solders was after 12 days. Meanwhile, the corrosion morphology indicated that the corrosion products of both Sn–37Pb and Sn–0.7Cu solders grew to be larger and denser. While those of Sn–3.0Ag solder grew larger firstly and then became smaller and denser because the grain growth dominated firstly and then the nucleation dominated with corrosion time. The corrosion mechanism was analyzed by using EDS, XRD, and XPS. The result showed that the carbon particulates from the fire smoke was detected which might promote the corrosion process and all solders had a common corrosion product, Sn21Cl16(OH)14O6. Besides, Sn–37Pb solder also contained other corrosion product, PbCl2. The present work could provide guidance to the risk assessment for electronic equipment rescue after a fire.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10

Similar content being viewed by others

References

  1. T. Rerek, L. Skowronski, M. Kobierski, M.K. Naparty, B. Derkowska-Zielinska, Microstructure and opto-electronic properties of Sn-rich Au–Sn diffusive solders. Appl. Surf. Sci. 451, 32–39 (2018)

    Article  Google Scholar 

  2. H. Chen, J. Peng, L. Fu, X. Wang, Y. Xie, Solder wetting behavior enhancement via laser-textured surface microcosmic topography. Appl. Surf. Sci. 368, 208–215 (2016)

    Article  Google Scholar 

  3. H. Chen, H.Y. Lee, C.S. Ku, A.T. Wu, Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures. J. Mater. Sci. 51, 3600–3606 (2016)

    Article  Google Scholar 

  4. M. Ramirez, L. Henneken, S. Virtanen, Oxidation kinetics of thin copper films and wetting behaviour of copper and organic solderability preservatives (OSP) with lead-free solder. Appl. Surf. Sci. 257, 6481–6488 (2011)

    Article  Google Scholar 

  5. B. Medgyes, B. Horváth, B. Illés, T. Shinohara, A. Tahara, G. Harsányi, O. Krammer, Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics. Corros. Sci. 92, 43–47 (2015)

    Article  Google Scholar 

  6. H. Huang, G. Shuai, X. Wei, C. Yin, Effects of sulfur addition on the wettability and corrosion resistance of Sn–0.7 Cu lead-free solder. MiRe 74, 15–21 (2017)

    Google Scholar 

  7. B. Horváth, T. Shinohara, B. Illés, Corrosion properties of tin–copper alloy coatings in aspect of tin whisker growth. J. Alloy. Compd. 577, 439–444 (2013)

    Article  Google Scholar 

  8. M. Rasid, Z. Azwan, M.H. Zainol, M.F. Omar, M.N.B. Derman, M. Nazeri, M. Firdaus, Corrosion performance of Sn–9Zn and Sn–0.7 Cuin 3.5% NaCl solution, solid state phenomena (Trans Tech Publications, Zurich, 2018), pp. 56–60

    Google Scholar 

  9. M. Rasid, Z. Azwan, M.F. Omar, M. Nazeri, M. Firdaus, Polarization study of Sn-0.7 Cu solder alloy in 1 M hydrochloric solution, Materials Science Forum (Trans Tech Publications, Zurich, 2017), pp. 394–399

    Google Scholar 

  10. S. Choi, J. Lucas, K. Subramanian, T. Bieler, Formation and growth of interfacial intermetallic layers in eutectic Sn–Ag solder and its composite solder joints. J. Mater. Sci. 11, 497–502 (2000)

    Google Scholar 

  11. Z. Wang, C. Chen, J. Liu, G. Zhang, K. Suganuma, Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution. Corros. Sci. 140, 40–50 (2018)

    Article  Google Scholar 

  12. M. Wang, J. Wang, W. Ke, Corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder joints. MiRe 73, 69–75 (2017)

    Google Scholar 

  13. Y. Gao, C. Cheng, J. Zhao, L. Wang, X. Li, Electrochemical corrosion of Sn–0.75 Cu solder joints in NaCl solution. Trans. Nonferrous Met. Soc. China 22, 977–982 (2012)

    Article  Google Scholar 

  14. W.R. Osório, E.S. Freitas, J.E. Spinelli, A. Garcia, Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution. Corros. Sci. 80, 71–81 (2014)

    Article  Google Scholar 

  15. R. Ambat, P. Møller, A review of corrosion and environmental effects on electronics. The Technical University of Denmark, DMS Vintermøde Proceedings (2006)

  16. W.R. Osorio, L.C. Peixoto, L.R. Garcia, A. Garcia, J.E. Spinelli, The effects of microstructure and Ag3Sn and Cu6Sn5 intermetallics on the electrochemical behavior of Sn–Ag and Sn–Cu solder alloys. Int. J. Electrochem. Sci. 7, 6436–6452 (2012)

    Google Scholar 

  17. W.R. Osório, C.M. Freire, R. Caram, A. Garcia, The role of Cu-based intermetallics on the pitting corrosion behavior of Sn–Cu, Ti–Cu and Al–Cu alloys. Electrochim. Acta 77, 189–197 (2012)

    Article  Google Scholar 

  18. W.R. Osório, J.E. Spinelli, C.R.M. Afonso, L.C. Peixoto, A. Garcia, Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn–Cu solder alloy. Electrochim. Acta 56, 8891–8899 (2011)

    Article  Google Scholar 

  19. Q. Bui, N. Nam, B.I. Noh, A. Kar, J.G. Kim, S.B. Jung, Effect of Ag addition on the corrosion properties of Sn-based solder alloys. Mater. Corros. 61, 30–33 (2010)

    Article  Google Scholar 

  20. A. Sharma, S. Das, K. Das, Electrochemical corrosion behavior of CeO2 nanoparticle reinforced Sn–Ag based lead free nanocomposite solders in 3.5 wt% NaCl bath. Surf. Coat. Technol. 261, 235–243 (2015)

    Article  Google Scholar 

  21. J.S. Newman, P. Su, G.G. Yee, S. Chivukula, Development of smoke corrosion and leakage current damage functions. Fire Saf. J. 61, 92–99 (2013)

    Article  Google Scholar 

  22. K. Xiao, X. Gao, L. Yan, P. Yi, D. Zhang, C. Dong, J. Wu, X. Li, Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: salty dust and diurnal temperature difference. Chem. Eng. J. 336, 92–101 (2018)

    Article  Google Scholar 

  23. Q. Li, X. Liu, S. Lu, Corrosion behavior assessment of tin–lead and lead free solders exposed to fire smoke generated by burning polyvinyl chloride. Mater. Chem. Phys. 212, 298–307 (2018)

    Article  Google Scholar 

  24. Q. Li, X. Liu, C. Li, X. Chen, S. Lu, Corrosion behavior of Sn–3.0 Ag–0.5 Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene. Mater. Corros. 69(6), 793–803 (2018)

    Article  Google Scholar 

  25. A. Salhi, S. Tighadouini, M. El-Massaoudi, M. Elbelghiti, A. Bouyanzer, S. Radi, S. El Barkany, F. Bentiss, A. Zarrouk, Keto-enol heterocycles as new compounds of corrosion inhibitors for carbon steel in 1M HCl: weight loss, electrochemical and quantum chemical investigation. J. Mol. Liq. 248, 340–349 (2017)

    Article  Google Scholar 

  26. Y. Hua, R. Jonnalagadda, L. Zhang, A. Neville, R. Barker, Assessment of general and localized corrosion behavior of X65 and 13Cr steels in water-saturated supercritical CO2 environments with SO2/O2. Int. J. Greenh. Gas Control 64, 126–136 (2017)

    Article  Google Scholar 

  27. Y. Zhao, E. Zhou, Y. Liu, S. Liao, Z. Li, D. Xu, T. Zhang, T. Gu, Comparison of different electrochemical techniques for continuous monitoring of the microbiologically influenced corrosion of 2205 duplex stainless steel by marine Pseudomonas aeruginosa biofilm. Corros. Sci. 126, 142–151 (2017)

    Article  Google Scholar 

  28. M. Park, D. Nam, K. Jung, K. Hong, H. Kwon, Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn–Ag alloy solders for flip-chip interconnections. RSC Adv. 7, 23136–23142 (2017)

    Article  Google Scholar 

  29. M. Wang, J. Wang, H. Feng, W. Ke, Effect of Ag3Sn intermetallic compounds on corrosion of Sn–3.0Ag–0.5Cu solder under high-temperature and high-humidity condition. Corros. Sci. 63, 20–28 (2012)

    Article  Google Scholar 

  30. C. Franch, E. Rodríguez Castellón, Á. Reyes Carmona, A.E. Palomares, Characterization of (Sn and Cu)/Pd catalysts for the nitrate reduction in natural water. Appl. Catal. A 425–426, 145–152 (2012)

    Article  Google Scholar 

  31. B. Liao, Z. Chen, Q. Qiu, X. Guo, Inhibitory effect of cetyltrimethylammonium bromide on the electrochemical migration of tin in thin electrolyte layers containing chloride ions. Corros. Sci. 118, 190–201 (2017)

    Article  Google Scholar 

  32. J. Byun, H.A. Patel, D. Thirion, C.T. Yavuz, Reversible water capture by a charged metal-free porous polymer. Polymer 126, 308–313 (2017)

    Article  Google Scholar 

  33. U. Evans, Electrochemical mechanism of atmospheric rusting. Nature 206, 980 (1965)

    Article  Google Scholar 

  34. M. Fayeka, A. Haseeb, M. Fazal, Electrochemical corrosion behaviour of Pb-free SAC 105 and SAC 305 solder alloys: a comparative study. Sains Malays. 46, 295–302 (2017)

    Article  Google Scholar 

Download references

Acknowledgements

The authors gratefully acknowledge financial support from the Fundamental Research the National Key R&D Program of China (No. 2016YFC0802101) and the National Natural Science Foundation of China (No. 51704268).

Author information

Authors and Affiliations

Authors

Corresponding authors

Correspondence to Shouxiang Lu or Xiao Chen.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Li, Q., Lin, J., Li, C. et al. Effect of polyvinyl chloride fire smoke on the long-term corrosion kinetics and surface microstructure of tin–lead and lead-free solders. J Mater Sci: Mater Electron 30, 16395–16406 (2019). https://doi.org/10.1007/s10854-019-02013-5

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-019-02013-5

Navigation