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Laser-drilling formation of through-glass-via (TGV) on polymer-laminated glass

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Abstract

A three-dimensional (3D) glass integrated passive device (IPD) is an evolutionally advanced configuration to dramatically reduce the electronics form factor and manufacturing cost of current IPDs by introducing ultra-thin glass with through-glass-vias (TGVs). A defect-free TGV formation technology in polymer-laminated glass substrates is required to realize a highly reliable 3D glass IPD. This paper discusses mechanisms of each defect formation in the use of several types of lasers to explore suitable technology for defect-free drilling in polymer-laminated glass.

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Acknowledgements

The authors would like to thank the member companies of the 3-D Systems Packaging Research Center (PRC), Georgia Institute of Technology, Atlanta for their support and technical guidance.

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Authors and Affiliations

  1. Nagoya University, Furo-cho, Chikusa, Nagoya, Aichi, 464-8601, Japan

    Yoichiro Sato, Kenji Ishikawa & Masaru Hori

  2. AGC Inc., 1-5-1 Marunouchi, Chiyoda, Tokyo, 100-8405, Japan

    Nobuhiko Imajyo

  3. Georgia Institute of Technology, 813 Ferst Drive NW, Atlanta, GA, 30332, USA

    Rao Tummala

Authors
  1. Yoichiro Sato
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  2. Nobuhiko Imajyo
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  3. Kenji Ishikawa
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  4. Rao Tummala
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  5. Masaru Hori
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Correspondence to Yoichiro Sato.

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Sato, Y., Imajyo, N., Ishikawa, K. et al. Laser-drilling formation of through-glass-via (TGV) on polymer-laminated glass. J Mater Sci: Mater Electron 30, 10183–10190 (2019). https://doi.org/10.1007/s10854-019-01354-5

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  • DOI: https://doi.org/10.1007/s10854-019-01354-5

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