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The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding

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Abstract

The palladium (Pd) distribution over the free air ball (FAB) and its effect on the ball’s shear strength were investigated in the Pd-coated copper (Cu) wire bonding process. It was found that for the same FAB/wire diameter ratio of 1.5, the bigger the electrical flame-off (EFO) current was, the larger would be the exposed Cu regions over FAB without Pd distribution. Combining experimental observations, a model of Pd distribution over FAB was first proposed by changing the EFO current and firing time. As the firing time increased, the coated Pd element could be dissolved into the Cu base to form a PdCu alloy at the FAB surface, to protect the bonded ball from corrosion. The Pd-coated Cu wire has higher bonding shear strength than the bare Cu wire. However, the FAB with the largest Pd coverage had the smallest ball shear strength, which revealed that the control of Pd distribution over FAB is very critical for a high-quality bonding interface.

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Acknowledgements

This work was financially supported by the National Key R&D Program of China (Grant No. 2017YFB0305700), the National Natural Science Foundation of China (Grant No. 51564025), and the Fund of the State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals (Grant No. SKL-SPM-201803).

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Authors and Affiliations

  1. Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China

    Yahong Du & Zhi-Quan Liu

  2. School of Materials Science and Engineering, University of Science and Technology of China, Shenyang, 110016, China

    Yahong Du & Zhi-Quan Liu

  3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China

    Hongjun Ji & Mingyu Li

  4. Kunming Institute of Precious Metals, Kunming, 650106, China

    Ming Wen

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  1. Yahong Du
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  2. Zhi-Quan Liu
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  3. Hongjun Ji
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  4. Mingyu Li
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Correspondence to Zhi-Quan Liu or Ming Wen.

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Du, Y., Liu, ZQ., Ji, H. et al. The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding. J Mater Sci: Mater Electron 29, 13774–13781 (2018). https://doi.org/10.1007/s10854-018-9508-z

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  • DOI: https://doi.org/10.1007/s10854-018-9508-z

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