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Reducing resistance and curing temperature of silver pastes containing nanowires

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Abstract

Low temperature silver pastes can be widely applied on thin-film switch, flexible printing line and touch screen. In this article, we investigated printability and conductivity of silver pastes with silver wires of different diameters and content, and the conductivity of the silver pastes cured at different temperatures filled with different types silver powders and silver wires. The sheet resistance of silver pastes cured at 100 °C with Ag1 powders and Ag2 powders filled with 10 wt% silver wires of 100 nm diameters is 21.93 ± 1.63 and 23.16 ± 1.44 Ω/□, which is lower than the same samples cured at 135 °C without silver wire fillers. Tap density of Ag1 and Ag2 powders mixed with silver nanowires is higher than that of Ag3 powders mixed with nanowires, due to a higher filling ratio of Ag1 and Ag2 powders with silver nanowires. SEM results show silver pastes filled with Ag1 and Ag2 powders formed network when silver nanowires were added.

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Authors and Affiliations

  1. Changsha Advanced Material Industry Research Institute Co. Ltd., B8-07, Wenxuan Road No. 27, High-tech Development Zone, Changsha, Hunan, China

    Dunying Deng, Chong Huang & Jin Ma

  2. Department of Materials Science and Engineering, National University of Defense Technology, Deya Road No. 115, Changsha, Hunan, China

    Shuxin Bai

Authors
  1. Dunying Deng
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  2. Chong Huang
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  3. Jin Ma
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  4. Shuxin Bai
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Correspondence to Dunying Deng.

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Deng, D., Huang, C., Ma, J. et al. Reducing resistance and curing temperature of silver pastes containing nanowires. J Mater Sci: Mater Electron 29, 10834–10840 (2018). https://doi.org/10.1007/s10854-018-9151-8

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  • DOI: https://doi.org/10.1007/s10854-018-9151-8

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