Abstract
Replacing silver paste contacts in silicon solar cells by electroplated nickel and copper (Ni/Cu) connections offer potential advantages of more exceptional grid lines, lower series resistance, and reduced costs in industrial silicon solar cell manufacturing. To achieve acceptance in the market for an electroplated Ni/Cu contacts sufficient contact adhesion has become the significant issue. In this work, a thin nickel layer was deposited on textured (001) silicon by an electroless plating method and form silicides by annealing treatment—this substrate designed as Ax–Si. Afterward, the Cu(15µ m)/Ni(240–1440 nm)/Ax–Si were prepared by electroplating techniques. The structures of Cu/Ni/Ax–Si characterized by scanning electron microscopy, transmission electron microscope and powder X-ray diffraction. Peel force tests were conducted using a universal testing machine. The peel force tests performed at an angle of 90° with a constant speed of 30 mm/min. Excellent adhesion force with 5.2 N/mm achieved.
Similar content being viewed by others
References
J. Trube, International Technology Roadmap for Photovoltaics (ITRPV) Results 2018, 9th edn. http://www.itrpv.net/Reports/Downloads/
Z.Y. Peng, Z. Liu, J.L. Chen, L.D. Liao, J. Chen, C. Li, W. Li, Reduce on the cost of photovoltaic power generation for polycrystalline silicon solar cells by double printing of Ag/Cu front contact layer. Electron. Mater. Lett. 14, 718 (2018)
K.H. Kim, S.H. Park, J.C. Park, I. Pang, S.W. Ryu, J.H. Oh, Fast pulling of n-type Si ingots for enhanced si solar cell production. Electron. Mater. Lett. 14, 461 (2018)
S.H. Hsieh, J.M. Hsieh, W.J. Chen, C.C. Chuang, Electroless nickel deposition for front side metallization of silicon solar cells. Materials 10, 942 (2017)
Y.R. Cheng, W.J. Chen, K. Ohdaira, K. Higashimine, Barrier properties of electroplating nickel layer for copper metallization in silicon solar cells. Int. J. Electrochem. Sci. 13, 11516 (2018)
A. Metz, D. Adler, S. Bagus, H. Blanke, M. Bothar, E. Brouwer, S. Dauwe, K. Dressler, R. Droessle et al., Industrial high-performance crystalline silicon solar cells and modules based on rear surface passivation technology. Sol. Energy Mater. Sol. Cells 120, 417 (2014)
J. Horzel, N. Bay, M. Passig, M. Sieber, J. Burschik, H. Kühnlein, A. Brand, A. Letize, B. Lee, D. Weber, R. Böhme, Low-cost metallisation based on Ni/Cu plating enabling high-efficiency industrial solar cells, in Proceedings of the 29th EU-PVSEC 2014 507-12. 29th European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC 2014), Amsterdam, The Netherlands, 22–26 September 2014
J. Bartsch, M. Kamp, D. Hartleb, C. Wittich, A. Mondon, B. Steinhauser, F. Feldmann, A. Richter, J. Benick, M. Glatthaar, M. Hermle, S.W. Glunz, 21.8% Efficient n-type solar cells with industrially feasible plated metallization. Energy Procedia 55, 400 (2014)
A. Mondon, M.N. Jawaid, J. Bartsch, M. Glatthaar, S.W. Glunz, Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells. Sol. Energy Mater. Sol. Cells 117, 209 (2013)
A. Rehman, S.H. Lee, E.G. Shin, S.H. Lee, Improved adhesion of Ni/Cu/Ag plated contacts with thermally formed nickel silicon interface for C-Si solar cells. Mater. Lett. 161, 181 (2015)
S. Kluska, J. Bartsch, A. Büchler, G. Cimiotti, A.A. Brand, S. Hopman, M. Glatthaar, Electrical and mechanical properties of plated Ni/Cu contacts for Si solar cells. Energy Procedia 77, 733 (2015)
G.O. Mallory, J.B. Hajdu, Electroless Plating: Fundamentals and Applications (Noyes Publications/William Andrew Publishing, New York, 1990)
M.V. Sullivan, J.H. Eigler, Electroless nickel plating for making ohmic contacts to silicon. J. Electrochem. Soc. 104, 226 (1957)
Acknowledgements
This research was funded by the Ministry of Science and Technology of Taiwan (Grant No. MOST 106-2221-E-224-013).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Hsiao, C.H., Wu, J.Y. & Chen, W.J. Adhesion strength of plated Ni/Cu metallization in Si solar cells. J Mater Sci: Mater Electron 30, 3539–3544 (2019). https://doi.org/10.1007/s10854-018-00631-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-018-00631-z